Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
MICRONE ME6208A30PG
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- MICRONE ME6208A30PG
- Type
- MICRONE
- Minimum package
- 1000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MICRONE
- Electronic Component
- ME6208A30PG
- Electronic Component
- 1
- Package
- SOT-89
- Electronic Component
- Linear Regulator(LDO)
- Electronic Component
- 0.132g
- Electronic Component
- 1
- Electronic Component
- BM0227605553
- Operating Temperature
- 45℃~+150℃
- Operating Voltage
- 18V
- Output
- Electronic Component
- Output Voltage
- 3V
- Output Current
- 150mA
- Output Type
- Electronic Component
- Output Channel Count
- 1
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ME6208A30PG 产品概述
ME6208A30PG 是 MICRONE（南京微盟）推出的一款固定输出线性稳压器（LDO），单通道、正输出、固定输出电压 3.0V。器件封装为 SOT-89，面向对静态电流和温度范围有严格要求的便携与工业应用场景。
一、主要参数一览
- 输出类型：固定（3.0V）
- 最大工作电压（Vin）：18V
- 输出电流：150mA（连续）
- 静态电流（Iq）：典型 3µA
- 输出极性：正极性
- 工作温度范围：-45℃ ~ +150℃
- 输出通道数：1
- 封装：SOT-89
二、关键特性与应用价值
- 超低静态电流（3µA）非常适合电池供电及待机功耗敏感的应用。
- 宽工作电压输入上限（18V）可兼容多种电源拓扑，便于与更高电压源配合使用。
- 宽温度范围（-45℃~+150℃）使器件适用于严苛环境与高温场合。
- SOT-89 小封装在尺寸与散热之间取得平衡，便于空间受限的电路设计。
三、热管理与功耗考量
线性稳压器的功耗由 (Vin - Vout) × Iout 决定。举例：若 Vin = 18V，Vout = 3V，Iout = 150mA，则耗散功率为 (18–3)×0.15 = 2.25W。SOT-89 的散热能力有限，须通过下列方式控制结温：
- 降低 Vin–Vout 差值或采用降压前端以减小功耗；
- 在 PCB 上增加大面积铜箔并采用热过孔/散热过孔扩展散热面积；
- 对输出电流进行期望值与环境温度下的降额设计，避免长期高压差高电流运行。
四、输入/输出电容与稳定性建议
- 在 VIN 引脚靠近器件放置输入电容，建议 1µF～10µF（陶瓷 X5R/X7R）以抑制电源瞬态。
- 在 VOUT 靠近器件处放置输出电容，常见取值 1µF～10µF，低 ESR 有利于稳压器稳定。
- 推荐尽量缩短电容与器件之间的走线，良好接地以降低环路噪声与振荡风险。具体容值与 ESR 对稳定性的影响请参照完整数据手册验证。
五、封装与电路布局要点
- SOT-89 为三脚小封装，管脚间走线应尽量短且粗，地线应连接到固体地平面。
- 在器件底下或焊盘周围增加铜箔面积并连接至内层/底层大面积地铜，以提高热扩散效率。
- 在高电流路径上使用较宽的走线，并避免将敏感模拟信号靠近热源或高电流回路。
六、典型应用场景
- 电池供电便携设备与传感节点（因低 Iq 适合待机低耗）；
- 工业控制与测量设备（宽温度特性）；
- 对输出噪声要求不高、需小体积稳压的点对点供电场合。
如需量产选型或热仿真评估，请获取 MICRONE 官方数据手册以确认引脚定义、保护特性（如限流、热关断、反向电流保护等）和详细电气参数，并按照应用工况做热降额与可靠性验证。若需进一步的封装热阻或典型电路图，可提供相应环境与负载条件以便给出更具体的建议。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece Integrated Circuit for IRS20124S IRS21956S SOP-20 IRS2453DS SOP-14
- Model
- IRS20124S
- Package
