WMSIC Electronic Components

MICRONE ME1117A33K3G

ModelME1117A33K3G
PackageTO-252-2
BrandMICRONE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MICRONE ME1117A33K3G
Type
MICRONE
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
1.4V@(1A)
Electronic Component
MICRONE
Electronic Component
ME1117A33K3G
Electronic Component
1
Package
TO-252-2
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.459g
Electronic Component
1
Electronic Component
BM0227715804
Operating Temperature
40℃~+125℃@(Ta)
Operating Voltage
15V
Output
Electronic Component
Output Voltage
3.3V
Output Current
1A
Output Type
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ME1117A33K3G 产品概述

一、产品简介

ME1117A33K3G 是南京微盟(MICRONE)推出的一款固定输出线性低压差稳压器(LDO),输出为正极 3.3V,单通道设计,适合对稳压精度和抗干扰有一定要求的中低功率电源场景。器件提供片内过热保护,工作温度范围广(-40℃ ~ +125℃ @ Ta),可靠性适合工业级应用。

二、主要参数

  • 输出电压:3.3V(固定)
  • 最大输出电流:1A
  • 压差(Dropout):1.4V @ 1A(即输入电压需高于约 4.7V)
  • 静态电流(Iq):10mA
  • 电源纹波抑制比(PSRR):65dB @ 1kHz
  • 工作电压(允许):最高可达 20V(典型工作电源设计常见于 ≤15V)
  • 输出极性:正极
  • 保护特性:过热保护(内置)
  • 工作温度:-40℃ ~ +125℃ (@Ta)
  • 封装:TO-252-2(DPAK)

三、关键特性与优势

  • 高 PSRR(65dB @1kHz)有效抑制来自开关电源或变压器的纹波与噪声,提升系统模拟与数字电路稳定性。
  • 1A 输出能力满足多数 MCU、传感器模组与射频前端供电需求。
  • 内置过热保护提高系统安全性,发生过载或散热不足时自动限制或关断输出。
  • 宽温度范围与工业级封装,适合工业控制、通信与仪表等环境。

四、典型应用

  • 单片机(MCU)和嵌入式系统供电(3.3V 节点)
  • 通信设备与网络模块供电
  • 传感器与数据采集前端
  • 工业控制、消费电子及测试设备的低噪电源设计

五、设计与布板注意事项

  • 为保证稳压器稳定工作,建议在输入与输出端配备去耦电容(例如输入端 10µF,输出端至少 10µF,具体电容类型与 ESR 由电路板和负载特性决定)。
  • 由于器件在高电压差和大电流下会产生显著功耗(Pd ≈ (Vin − Vout) × Iout),需做好散热设计:选择合适散热垫、加大铜箔面积或配合散热片。
  • 运行时若输入电压接近器件最大额定值(近 20V),应评估功耗与热应力,推荐典型供电不超过 15V 以延长可靠性。
  • 布板时将散热脚与地平面良好连接,降低结温,保证过热保护有余量。

六、封装与采购提示

ME1117A33K3G 采用 TO-252-2(DPAK)封装,适合表面贴装与有一定散热需求的应用。采购时注意选购来自正规渠道的 MICRONE(南京微盟)原装件,并查看数据手册以确认输入电压范围、典型热阻与应用电容建议,确保设计与实际应用一致。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.