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MOLEX 5013300600
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- MOLEX 5013300600
- Type
- MOLEX
- Unit
- Electronic Component
- Minimum package
- 1000 袋
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- MOLEX
- Electronic Component
- 5013300600
- Electronic Component
- 1
- Package
- P=1mm
- Electronic Component
- 1
- Electronic Component
- (Wire-to-Board / Wire-to-Wire)
- Electronic Component
- 0.085g
- Electronic Component
- 1mm
- Electronic Component
- Electronic Component
- Electronic Component
- 1
- Electronic Component
- BM0264913527
- Electronic Component
- PA
- Operating Temperature
- 40℃~+105℃
- Socket
- 1x6P
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
5013300600 产品概述
一、产品简介
5013300600 为 MOLEX 品牌的胶壳系列产品，适用于线对板（wire-to-board）和线对线（wire-to-wire）连接场合。该款为单排 1x6P 结构，间距 P=1.0mm，外壳为白色，设计紧凑，适合空间受限的消费类与工业电子设备内线缆连接需求。
二、主要规格与材质
- 排数：1 排；每排 PIN 数：6
- 插孔结构：1x6P；间距（Pitch）：1.0 mm
- 颜色：白色
- 塑料材质：PA（聚酰胺）
- 阻燃等级：UL94V-0
- 工作温度范围：-40℃ ~ +105℃
- 品牌：MOLEX；封装标注：P=1mm
三、结构与连接特性
该胶壳采用标准化 1mm 间距，便于高密度布线与模块化设计，适配相应规格的压接端子或插针。PA 材料兼顾机械强度与尺寸稳定性，UL94V-0 等级提供良好的阻燃保护，适合对安全性有要求的应用环境。单排 6P 布局便于信号与电源的混合布线或多路信号分配。
四、典型应用场景
适用于便携式设备、摄像头模块、低压控制模块、LED 驱动器、传感器接口、小型工业控制器及其他需紧凑连接器的场合。工作温度范围覆盖大多数室内和轻工业环境，材料性能满足一般耐候与电气绝缘要求。
五、选型与安装注意事项
选用时建议确认与之配套的端子和插头型号（压接型或焊接型），并核对线径与端子兼容性。装配过程中注意避免超出产品额定温度与机械应力；在要求更高环境（如高湿、高温、振动）时，应进一步确认密封与固定方案。出于安全与可靠性考虑，采购时可向供应商确认 RoHS、物料认证及具体配套件清单。
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