WMSIC Electronic Components

MOLEX 5023860470

Model5023860470
PackageSMD, P=1.25mm
BrandMOLEX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MOLEX 5023860470
Type
MOLEX
Minimum package
1200 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MOLEX
Electronic Component
5023860470
Electronic Component
1
Package
SMD, P=1.25mm
Electronic Component
1
Electronic Component
Wire-to-Board
Electronic Component
0.52g
Electronic Component
1.25mm
Electronic Component
Electronic Component
PIN
4P
Electronic Component
1
Electronic Component
BM0265736899
Electronic Component
Electronic Component
Operating Temperature
40℃~+105℃
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MOLEX 5023860470线对板针座产品概述

MOLEX 5023860470是一款针对小型化电子设备设计的单排卧贴线对板针座,核心围绕1.25mm小间距、低功耗传输需求打造,兼具可靠性与生产适配性,广泛适用于IoT、消费电子等领域。

一、产品核心参数梳理

该针座的关键参数明确,可直接匹配多数低功耗电路设计:

  • 机械参数:间距1.25mm,单排布局,总PIN数4P,卧贴(SMD)安装方式;
  • 电气参数:额定电流1A(AC/DC通用),额定电压50V(符合低压安全规范);
  • 材料与镀层:触头采用铜合金(高导电率),表面镀锡(抗氧化、易焊接);
  • 环境适应性:工作温度范围-40℃~+105℃,白色耐高温壳体;
  • 品牌与封装:MOLEX原厂出品,SMD卧贴封装,适配回流焊工艺。

二、核心设计特性解析

  1. 1.25mm小间距紧凑布局
    针对便携式、微型化设备的空间限制,1.25mm间距相比常规2.0mm间距节省约37%的PCB占用面积,4Pin单排设计可同时传输多路低功耗信号(如数据、电源),适配传感器、蓝牙模块等小型组件。

  2. 卧贴SMD安装优势
    表面贴装工艺无需PCB钻孔,可直接通过回流焊实现自动化贴装,生产效率较插件式提升30%以上;同时避免插件孔对PCB布线的干扰,适合高密度电路设计。

  3. 触头可靠性设计
    铜合金触头兼顾导电率与机械强度,镀锡层厚度符合MOLEX标准(约2-3μm),既保证焊接时的润湿性能(减少虚焊率),又能抵御环境中的氧化与腐蚀,延长产品使用寿命。

三、性能指标与环境适应性

  • 电流/电压容量:1A额定电流满足多数低功耗设备的电源传输需求(如5V/1A供电的IoT节点),50V额定电压覆盖常见低压电路(避免过压风险);
  • 宽温工作范围:-40℃~+105℃符合工业级温区要求,可稳定工作于户外、汽车舱内等极端环境(如车载温度传感器、户外气象监测设备);
  • 振动/冲击耐受:MOLEX针座的触头接触压力设计(约0.5-0.8N)可抵御10G以内的振动(符合IEC 60068-2-6标准),避免运输或使用中的接触不良。

四、典型应用场景

该针座的参数特性使其适配以下领域:

  1. IoT终端设备:智能传感器节点、低功耗蓝牙模块(如温湿度传感器、门禁读卡器);
  2. 便携式消费电子:智能手环、蓝牙耳机、移动电源内部的信号/电源连接;
  3. 汽车电子辅助系统:车内氛围灯控制器、胎压监测传感器的线对板连接;
  4. 工业控制小型模块:PLC扩展I/O模块、小型继电器控制板的信号传输。

五、包装与环保要求

MOLEX 5023860470采用卷装包装(常见规格为1000个/卷),适配自动化贴片机供料;产品符合RoHS 2.0及REACH环保标准,无铅镀层可兼容无铅焊接工艺,满足现代电子制造的环保与工艺要求。

六、总结

MOLEX 5023860470作为一款高性价比的1.25mm卧贴线对板针座,通过紧凑设计、可靠触头与宽温适应性,精准匹配小型化、低功耗电子设备的连接需求,是IoT、消费电子等领域的优选组件。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.