Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MOLEX 5023860470是一款针对小型化电子设备设计的单排卧贴线对板针座,核心围绕1.25mm小间距、低功耗传输需求打造,兼具可靠性与生产适配性,广泛适用于IoT、消费电子等领域。
该针座的关键参数明确,可直接匹配多数低功耗电路设计:
1.25mm小间距紧凑布局
针对便携式、微型化设备的空间限制,1.25mm间距相比常规2.0mm间距节省约37%的PCB占用面积,4Pin单排设计可同时传输多路低功耗信号(如数据、电源),适配传感器、蓝牙模块等小型组件。
卧贴SMD安装优势
表面贴装工艺无需PCB钻孔,可直接通过回流焊实现自动化贴装,生产效率较插件式提升30%以上;同时避免插件孔对PCB布线的干扰,适合高密度电路设计。
触头可靠性设计
铜合金触头兼顾导电率与机械强度,镀锡层厚度符合MOLEX标准(约2-3μm),既保证焊接时的润湿性能(减少虚焊率),又能抵御环境中的氧化与腐蚀,延长产品使用寿命。
该针座的参数特性使其适配以下领域:
MOLEX 5023860470采用卷装包装(常见规格为1000个/卷),适配自动化贴片机供料;产品符合RoHS 2.0及REACH环保标准,无铅镀层可兼容无铅焊接工艺,满足现代电子制造的环保与工艺要求。
MOLEX 5023860470作为一款高性价比的1.25mm卧贴线对板针座,通过紧凑设计、可靠触头与宽温适应性,精准匹配小型化、低功耗电子设备的连接需求,是IoT、消费电子等领域的优选组件。
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Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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