WMSIC Electronic Components

MOLEX 5023510600

Model5023510600
PackageP=2mm
BrandMOLEX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

15 specifications

Core information

Product name
MOLEX 5023510600
Type
MOLEX
Unit
Electronic Component
Minimum package
500 袋

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MOLEX
Electronic Component
5023510600
Electronic Component
1
Package
P=2mm
Electronic Component
0.272g
Electronic Component
1
Electronic Component
BM0265611321
Electronic Component
Electronic Component
Electronic Component
500

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MOLEX 5023510600 连接器产品概述

一、产品核心身份与系列归属

MOLEX 5023510600是DuraClik MX 2.0系列的线对板/线对线胶壳,属于MOLEX旗下小间距连接器产品线。该型号以1排6Pin(1x6P)规格、2mm中心间距为核心特征,适配DuraClik系列标准端子(如50235系列端子),是紧凑空间内多信号连接的经典选型。

二、关键参数与结构特性

  1. 规格与间距:采用1排6Pin(1x6P)布局,中心间距2mm,符合小间距高密度连接需求,可有效节省PCB与设备内部空间,适配小型化产品趋势。
  2. 结构设计:
    • 带锁扣:继承DuraClik系列正向锁扣特性,连接时产生“咔哒”反馈,确保端子与胶壳完全啮合,抵抗振动、冲击导致的松脱;
    • 无侧翅:胶壳无翅片设计,安装无需避让空间,适配PCB布局紧凑场景。
  3. 连接类型:支持线对板、线对线两种方式,通用性强,灵活适配不同系统的信号/电源连接需求。

三、材料与环境适应性

  1. 主体材质:胶壳采用PBT(聚对苯二甲酸丁二醇酯),具备机械强度高、耐化学腐蚀、尺寸稳定等特点,长期承受复杂环境应力。
  2. 阻燃性能:通过UL94V-0阻燃认证,火灾场景下延缓火焰蔓延,满足电子设备安全规范。
  3. 温度范围:工作温度覆盖**-40℃~+105℃**,适配低温户外(如北方冬季设备)、高温工业(如电机附近模块)及部分汽车低压系统(如座椅传感器接口)。

四、典型应用场景

该型号因小间距、可靠锁扣、宽温阻燃等特性,广泛应用于:

  1. 消费电子:智能穿戴(手环/手表内部连接)、小型家电(迷你加湿器控制模块)、便携数码(蓝牙音箱信号连接);
  2. 工业控制:小型PLC模块、传感器节点(温度/压力传感器输出)、微型伺服电机驱动板;
  3. 通信设备:5G微基站子板连接、家用千兆路由器内部模块连接;
  4. 汽车电子:低压辅助系统(氛围灯控制、车门传感器接口)。

五、核心选型优势

  1. 高密度空间利用:2mm间距+1x6P布局,相比3mm间距节省约30%安装空间,适配小型化设计;
  2. 可靠连接保障:锁扣设计通过振动测试(IEC 60068-2-6标准),适合移动设备与工业振动场景;
  3. 宽环境适应性:温度范围与阻燃等级满足多行业规范,降低环境适配风险;
  4. 成熟供应链:MOLEX DuraClik系列成熟型号,货源稳定,技术资料完善,便于量产导入。

该产品兼顾紧凑性、可靠性与环境适应性,是小间距多信号连接场景的高性价比选型。

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