Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
MOLEX 87832-1420
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
14
specifications
Core information
- Product name
- MOLEX 87832-1420
- Type
- MOLEX
- Minimum package
- 32 管
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MOLEX
- Electronic Component
- 87832-1420
- Electronic Component
- 1
- Package
- Tube
- Electronic Component
- Wire-to-Board
- Electronic Component
- 0g
- Electronic Component
- 1
- Electronic Component
- BM0119775147
- Electronic Component
- Electronic Component
- Electronic Component
- 32
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：MOLEX 87832-1420
一、基本信息
MOLEX 87832-1420是一款高性能的PCB连接器，采用了2.00mm的间距设计，使其适用于多种应用场合。该产品采用双排垂直结构，表面安装方式，并配备了遮罩（shrouded）设计，确保连接稳定性以及防止误插。这款连接器特别适合在空间有限的环境中使用。
二、设计与特点
间距与排数： 87832-1420的引脚间距为2.00mm，拥有14个电路，符合Milli-Grid系列的标准。双排的设计不仅提高了电路的连接密度，还使其在较小尺寸的PCB布局中仍能保持良好的使用效果。
表面安装设计： 该连接器的表面安装特性使其适用于现代电子设备中，尤其是在自动生产线上，能够实现高速和高效的组装。表面安装的方式增强了与PCB的连接可靠性，减少了因焊接不良导致的故障。
保护机制： 87832-1420还设计了锁定窗口（Locking Windows）和中央极化槽（Center Polarization Slot），极大地增强了连接的稳固性。这些特性可以防止连接器在插拔过程中发生意外脱落，确保电气连接的连续性。
材料与表面处理： 为了提高连接器的耐用性和导电性能，87832-1420采用了无铅材料，并进行了0.38微米的金（Au）镀层处理。这种镀层不仅提高了插接的可靠性，还有助于抵御氧化，从而提升了连接器的电气性能和使用寿命。
PCB定位器： 连接器配备的PCB定位器有助于在组装过程中进行准确的对准，降低了因配合不当而造成的潜在问题。这一设计的应用能够显著提升生产的效率和可靠性。
三、应用场景
MOLEX 87832-1420连接器广泛应用于各类电子设备和行业，尤其在需要高密度连接和可靠性的领域表现优异。常见的应用场景包括：
- 消费电子产品：如智能手机、平板电脑、个人电脑等。
- 通讯设备：例如路由器、交换机及其他网络设备。
- 工业自动化：在机器人、传感器及控制系统中发挥重要作用。
- 医疗设备：如监护仪、诊断设备等，要求连接器具有高度的可靠性和耐用性。
四、技术参数
- 品牌: MOLEX
- 连接器类型: PCB Header
- 类型: 没有铅 (Lead-Free)
- 镀层: 0.38µm 黄金镀层
- 电路数量: 14
- 引脚间距: 2.00mm
- 封装方式: Tube
- 安装方式: 表面安装 (Surface Mount)
- 锁定机制: 带锁定窗口和中央极化槽
五、总结
MOLEX 87832-1420是一款设计优良、性能卓越的电子连接器，广泛适用于各种高密度连接需求的场合。其独特的设计提供了多种保护机制和高可靠性，适合在现代不断发展的电子产品中使用。作为一款多功能的连接解决方案，87832-1420能够满足行业内广大客户对性能和质量的严格要求，是企业在选择连接器时的理想选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
