WMSIC Electronic Components

MEIHUA MHS110CGCT

ModelMHS110CGCT
PackageSMD,1.5x3mm
BrandMEIHUA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MEIHUA MHS110CGCT
Type
MEIHUA
Minimum package
2000 圆盘

Technical parameters

Power
60mW
Electronic Component
Electronic Component
Electronic Component
MEIHUA
Electronic Component
MHS110CGCT
Electronic Component
1
Package
SMD,1.5x3mm
Electronic Component
567.5nm~575.5nm
Electronic Component
LEDDiode / LED
Electronic Component
0.031g
Electronic Component
1
LED
57mcd
LED
120°
LED
Electronic Component
Electronic Component
BM0226603470
Electronic Component
575nm
Operating Temperature
35℃~+85℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MHS110CGCT(MEIHUA 美华)黄绿色 SMD LED 3×1.5mm 产品概述

一 产品简介

MHS110CGCT 是美华(MEIHUA)推出的一款小体积侧贴式发光二极管,封装为 SMD 1.5×3.0 mm,透明透镜,发光颜色为黄绿色(峰值波长 575 nm)。该器件设计用于面板指示、状态显示与小型照明点光源,具有较宽的发光角度与稳定的电光特性,适合自动贴装(SMT)生产线使用。

二 主要参数

  • 标称正向电流(If):20 mA
  • 额定功率:60 mW
  • 峰值波长(λp):575 nm(波长范围 567.5 nm ~ 575.5 nm)
  • 发光强度(Iv):57 mcd(在 If=20 mA 条件下)
  • 发光角度:120°(典型)
  • 正向压降(Vf):1.75 V ~ 2.35 V(根据 If 与温度变化)
  • 工作温度:-35 ℃ ~ +85 ℃
  • 发光颜色:黄绿色
  • 透镜:无色透明透镜
  • 封装与供带:SMD,1.5×3 mm,侧贴载带(适合贴片机)

三 光学与电气特性说明

该 LED 在 575 nm 附近有较强的光谱输出,属黄绿色可见光,适合用于对比度高且视觉识别效率好的指示场景。120° 的发光角度提供宽视角分布,便于面板或指示灯在不同观察角度都能被识别。正向压降在 1.75–2.35 V 之间,实际电压随驱动电流与结温而变化;在 20 mA 条件下典型发光强度约 57 mcd。

四 封装与贴装信息

器件为小型表面贴装封装(1.5×3.0 mm),透明透镜利于均匀发光。侧贴载带便于高速贴装机取放,适配常见 SMT 生产流程。安装时建议参照厂方提供的机械图与推荐 PCB 焊盘图,以保证良好焊接可靠性与合适的光学位置。

五 典型应用场景

  • 仪器面板与状态指示灯
  • 消费电子指示与装饰照明
  • 通信、汽车内饰(非关键安全部位)指示
  • 交通信号指示板、小型背光点源

六 使用建议与注意事项

  • 驱动与限流:建议恒流驱动或串联限流电阻。示例(取 Vf ≈ 2.0 V):
    • 5 V 电源:R ≈ (5 − 2.0) / 0.02 ≈ 150 Ω
    • 3.3 V 电源:R ≈ (3.3 − 2.0) / 0.02 ≈ 65 Ω(可选标准值 68 Ω)
  • 考虑寿命与可靠性,建议在实际产品中采用 10–15 mA 的降额工作以降低热应力并延长寿命。
  • 焊接工艺:建议按 JEDEC/J-STD-020 等回流标准及厂方回流曲线进行回流焊,避免超过推荐的峰值温度与时间以保护封装与芯片。
  • 静电防护:LED 对静电敏感,装配与测试时应采取 ESD 防护措施(接地手环、离子风等)。
  • 储存与湿敏:避免长期高温高湿存放,开卷后按厂方建议进行回流焊接周期或回流前干燥处理。

七 PCB 设计与装配建议

  • 请参考厂方推荐的焊盘和封装图纸进行 PCB 设计,确保焊盘尺寸、焊盘间距与贴装方向一致。
  • 采用适当焊膏量与模板开孔比(通常 60–80% 的焊盘覆盖率为参考值),以帮助形成良好焊点且避免过多焊膏溢出影响透镜与光学一致性。
  • 对于光学均一性要求较高的应用,注意 LED 在 PCB 上的排列与遮挡物距离;避免铜箔或金属覆盖造成局部吸热或遮光。

八 可靠性与质量保证

器件额定工作温度为 -35 ℃ 至 +85 ℃,在推荐条件和正确驱动下,可获得稳定的光输出与长期可靠性。针对量产使用,建议进行进货检验、来料光电测试与电气特性抽检,并在产品级进行高温、高湿、振动等可靠性验证以匹配最终应用需求。

如需详细的机械图、回流曲线、光谱曲线或其他认证资料,建议向 MEIHUA(美华)或授权经销商索取原厂数据手册与参考资料,以便在设计与量产中得到最佳结果。

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