Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
MEIHUA MHL3014UGDGT
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- MEIHUA MHL3014UGDGT
- Type
- MEIHUA
- Minimum package
- 1000 圆盘
Technical parameters
- Power
- 120mW
- Electronic Component
- Electronic Component
- Electronic Component
- MEIHUA
- Electronic Component
- MHL3014UGDGT
- Electronic Component
- 1
- Package
- Through-hole, D=3mm
- Electronic Component
- 520nm~525nm
- Electronic Component
- LEDDiode / LED
- Electronic Component
- 0.16g
- Electronic Component
- 1
- LED
- 4.5cd
- LED
- 45°
- LED
- Electronic Component
- Electronic Component
- BM0257385022
- Operating Temperature
- 30℃~+90℃
- Current
- 20mA
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MHL3014UGDGT — 3mm绿色雾状圆头LED产品概述
一、产品简介
MHL3014UGDGT 是美华（MEIHUA）推出的一款高亮度绿色发光二极管，封装为常见的 D=3mm 插件圆头结构。雾状绿色透镜配合 45° 发光角设计，可获得柔和且集中的绿色光束，光色波长集中在 520–525nm，适合做视觉提示与面板背光等用途。
二、主要电气与光学参数
- 发光颜色：绿色（峰值波长 520–525nm）
- 正向压降 Vf：2.8V ~ 3.2V（典型值视电流与温度略有变化）
- 正向电流 If（工作）：20mA（建议典型驱动电流）
- 功率（额定）：120mW
- 发光强度：4500mcd（在 20mA 测试条件下）
- 发光角度：45°（典型）
- 透镜：雾状绿色，起到漫射与减眩作用
三、机械与环境特性
- 封装形式：插件 (Through‑Hole)，直径 3mm 圆头
- 工作温度范围：-30°C ~ +90°C
该封装便于手工或波峰/回流焊接，适合传统 PCB 插件布局和面板安装。
四、应用场景
- 仪表面板和状态指示灯
- 家电与消费电子指示
- 控制面板、键盘背光与状态提示
- 小型信号与指示系统、教育与演示产品
五、驱动与电路建议
为保证稳定工作，建议恒流驱动或串联限流电阻的恒压供电方案。举例：5V 供电时，电阻可按 R = (Vs - Vf) / If 计算，若取 Vf≈3.0V、If=20mA，则 R ≈ 100Ω（可选 100–150Ω 增加裕度）。如使用恒流源，设置为 20mA 即可获得规格内亮度与寿命。
六、装配与可靠性建议
- 焊接：尽量遵循常见插件 LED 焊接规范，避免长时间高温直烙，推荐焊接温度与时间控制在工业通用安全范围内以保护封装与内芯。
- 防静电：产品对 ESD 敏感，装配与存储时应采取防静电措施。
- 存储：避免高温高湿环境，长期存放建议干燥密封以延长寿命。
七、总结
MHL3014UGDGT 为一款性能稳定、亮度高且透镜漫射效果良好的 3mm 插件绿色 LED，适合需要清晰、柔和指示光的各类电子产品。其标准化封装与典型 20mA 驱动电流使其便于在现有电路中替换与集成，是通用指示灯应用的理想选择。若需更详细的电气特性曲线或封装尺寸图，请联系供应商或索取完整数据手册。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
