WMSIC Electronic Components

MEIHUA MHL5013UYDYT

ModelMHL5013UYDYT
PackageThrough-hole, D=5mm
BrandMEIHUA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MEIHUA MHL5013UYDYT
Type
MEIHUA
Minimum package
1000 袋

Technical parameters

Power
80mW
Electronic Component
Electronic Component
Electronic Component
MEIHUA
Electronic Component
MHL5013UYDYT
Electronic Component
1
Package
Through-hole, D=5mm
Electronic Component
590nm
Electronic Component
LEDDiode / LED
Electronic Component
0.3g
Electronic Component
1
LED
80mcd
LED
40°
LED
Electronic Component
Electronic Component
BM0226069674
Electronic Component
593nm
Operating Temperature
25℃~+85℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MHL5013UYDYT(MEIHUA 美华)5mm 黄色插件LED 产品概述

一、产品简介

MHL5013UYDYT 是美华(MEIHUA)推出的一款5mm圆头黄色发光二极管(LED),采用插件(穿孔)封装,型号标识明确、便于工程选型。该器件以窄视角、高亮度和宽工作温度范围为主要特点,适合面板指示、状态显示、仪表及各类消费和工业电子产品的指示灯用途。

二、主要电光学参数

  • 发光颜色:黄色
  • 名义波长(Dominant/WL):590 nm
  • 峰值波长(Peak):593 nm
  • 发光强度:80 mcd(典型值,IF = 20 mA)
  • 发光角度:40°(典型半值角)
  • 正向电流(IF):20 mA(标准工作电流)
  • 正向压降(Vf):2.2 V(IF = 20 mA,典型)
  • 功率耗散:80 mW(器件标称功率)
  • 工作温度范围:-25 ℃ 至 +85 ℃

备注:以上为典型/标称参数,实际选型时建议参考厂家的完整数据手册与IV、光强测试数据。

三、结构与封装

  • 封装类型:插件(穿孔),圆形透镜,直径 D = 5 mm
  • 灯头为高透光聚合物透镜,集中光束(40°)以提高定向可见性,适合作为面板或仪表的定点指示光源。
  • 通过孔封装便于手工焊接与传统波峰焊装配工艺。

四、热与电气注意事项

  • 最大工作电流通常以 20 mA 为常规限制,超过该电流将加速光衰并可能损伤器件。
  • 器件功率耗散理论值:P = Vf × IF = 2.2 V × 20 mA = 44 mW(实际耗散),低于器件标称80 mW;但应考虑PCB温升与环境温度对寿命的影响。
  • 在高环境温度下应做电流降额处理以延长寿命与维持光输出稳定性。
  • 建议采用恒流驱动或带限流的电阻式限流电路,避免瞬间过流。

五、应用建议

  • 指示灯与状态显示(面板、仪表、开关)
  • 消费电子与家电的指示标识
  • 仪器仪表、工业控制指示
  • 小型指示牌与信号提示系统 因其窄视角和适中的发光强度,MHL5013UYDYT 特别适用于需要较高方向性且不要求极高光输出的场合。

六、焊接与装配建议

  • 手工焊接:建议烙铁温度控制在 300~350 ℃,焊接时间尽量控制在 3~5 秒内以减少对LED封装的热应力。
  • 波峰/回流焊:如需采用波峰焊,建议参考厂方波峰温度曲线,一般不超过 260 ℃ 并缩短处理时间。
  • 插件引脚弯曲时避免在靠近封装处弯折,建议在离封装一定距离处做形变以减少封装应力。
  • 进入生产前应做样件的焊接热冲击验证。

七、质量与可靠性注意点

  • ESD(静电)敏感,装配与测试环境建议采用防静电措施(接地、腕带、抗静电垫等)。
  • 建议对批量采购样品进行抽样的电气、光学和寿命测试(如恒流老化、热循环、湿热测试等)。
  • 长期高温或持续过流会加速光输出衰减(光衰),应做合理驱动与散热设计。

八、选型与典型电路举例

  • 典型限流电阻计算(以 5 V 电源为例):R = (Vs - Vf) / IF = (5.0 - 2.2) / 0.02 ≈ 140 Ω,常用 150 Ω。
  • 若使用 12 V 电源:R ≈ (12 - 2.2) / 0.02 ≈ 490 Ω,常用 510 Ω。
  • 推荐在较长连线或高电压应用中采用恒流源驱动以保证亮度一致性并减少电源波动对LED的影响。

九、总结

MHL5013UYDYT 是一款典型的 5mm 黄色插件LED,具有良好的方向性(40°)和稳定的黄色光谱(~590–593 nm),适用于广泛的指示应用。标准工作电流 20 mA、典型正向压降 2.2 V,使其便于在常见电源环境中集成。选型时请结合具体环境温度、驱动方式与期望寿命做合适的电流/热管理与可靠性验证,以确保长期稳定运行。若需更详细的电气曲线、光谱分布或封装尺寸图,建议索取厂家的完整数据手册。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.