WMSIC Electronic Components

Mini-Circuits LFCN-490+

ModelLFCN-490+
PackageSMD-4P,3.2x1.6mm
BrandMini-Circuits
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Mini-Circuits LFCN-490+
Type
MINI-CIRCUITS
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MINI-CIRCUITS
Electronic Component
LFCN-490+
Electronic Component
1
Package
SMD-4P,3.2x1.6mm
Electronic Component
RFFilter
Electronic Component
0.154g
Electronic Component
50Ω
Electronic Component
1
Electronic Component
BM0264880918
Operating Temperature
55℃~+100℃
Frequency
650MHz
Electronic Component
1.2dB
Filter Type
Electronic Component
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LFCN-490+ 产品概述

一、产品简介

LFCN-490+ 为 Mini‑Circuits 品牌的表面贴装低通滤波器(Signal conditioning LOW PASS FLTR)。该器件采用 SMD‑4P 小型封装(3.2 × 1.6 mm),面向需要紧凑、可靠射频滤波的应用场景。器件符合 RoHS 环保要求,适合在工业到通信等级的电路板上作为前端或中间级滤波元件使用。

二、主要规格

  • 滤波类型:低通(Low Pass)
  • 截止频率:650 MHz(根据提供信息)
  • 特性阻抗:50 Ω
  • 插入损耗:1.2 dB(典型值,视频率位置略有变化)
  • 工作温度范围:-55 ℃ 至 +100 ℃
  • 封装:SMD‑4P,尺寸 3.2 × 1.6 mm
  • 描述标识:SIGNAL REGULATION / SURF MT / RoHS

三、关键特性与优势

  • 小型化封装:3.2 × 1.6 mm 的 SMD‑4P 封装便于高密度 PCB 布局,适合现代紧凑射频模块。
  • 低插入损耗:典型 1.2 dB 的插损在通带内可保证信号能量损失较小,有利于维持系统灵敏度与增益预算。
  • 50 Ω 匹配:与常见射频系统阻抗兼容,简化前后级匹配设计。
  • 宽温度适应:-55 ℃ 至 +100 ℃ 的工作温度适合多数工业与通信环境,可靠性高。
  • RoHS 合规:满足环保与相关法规要求,便于产品认证与量产。

四、典型应用

  • 无线通信收发前端:用于抑制高频杂波与镜像频段,保护下游低噪放大器与混频器。
  • ADC 抗混叠前端:在宽带采样系统中对高频成分进行有效衰减,降低混叠影响。
  • 信号整形与谐波抑制:在发射链路中减少高次谐波泄露,满足发射谱线规范。
  • 测试测量与射频模块:适配小型化射频子系统与便携测试设备。

五、封装与安装建议

  • PCB 区域应保持良好接地平面,滤波器引脚周边布置过孔(vias)以保证低阻抗接地。
  • 尽量将滤波器放置于信号源或敏感器件附近,缩短信号走线长度,减小寄生与辐射耦合。
  • 使用 50 Ω 传输线(微带或同轴布局)以维持阻抗连续性,避免反射导致性能退化。
  • 焊接工艺遵循厂商推荐回流曲线,避免过热或机械应力导致元件损伤。

六、可靠性与环境适应

该器件设计考虑工业温度范围并通过常规环境与机械应力验证。长期工作时应关注 PCB 散热路径与周边器件温升,确保在 +100 ℃ 上限内长期稳定工作。存储与使用环境避免强腐蚀性气体与剧烈振动。

七、选型建议与注意事项

  • 虽然型号为 LFCN‑490+,但推荐在最终设计前参阅 Mini‑Circuits 官方数据手册,确认频率响应曲线(通带宽度、阻带抑制、回波损耗)与目标应用的匹配。
  • 在关键应用中建议进行样件测试并在目标板上验证插入损耗、群延迟与阻带衰减等实际指标。
  • 如需更高功率处理或不同截止频点,可参考厂商其它低通系列或联系供应商获取定制建议。

如需我帮忙整理该器件的典型 S‑参数文件或给出针对特定 PCB 布局的布局示意与仿真建议,可提供频段与电路环境后进一步详细说明。

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