Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Mini-Circuits LFCN-530+
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Mini-Circuits LFCN-530+
- Type
- MINI-CIRCUITS
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MINI-CIRCUITS
- Electronic Component
- LFCN-530+
- Electronic Component
- 1
- Package
- SMD-4P,3.2x1.6mm
- Electronic Component
- RFFilter
- Electronic Component
- 40dB；20dB
- Electronic Component
- 0.1g
- Electronic Component
- 50Ω
- Electronic Component
- 1
- Electronic Component
- BM0265000477
- Operating Temperature
- 55℃~+100℃
- Frequency
- 700MHz
- Electronic Component
- 1.2dB
- Filter Type
- Electronic Component
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LFCN-530+ 产品概述
一、产品简介
LFCN-530+ 是 Mini-Circuits 提供的一款表面贴装式低通滤波器，专为射频/微波信号调节设计。该器件在 50Ω 系统中工作，面向需要平坦通带、低插入损耗和宽温度适应性的信号链前端与中频处理环节，满足 RoHS 环保要求，适合集成到紧凑型射频模块与混合信号系统中。
二、主要电气参数
- 滤波类型：低通（Low Pass）
- 截止频率：700 MHz（设计参考频点）
- 阻抗：50 Ω 匹配系统
- 插入损耗：典型 1.2 dB（通带内）
- 工作温度：-55℃ ~ +100℃
以上参数反映了器件在常见射频工况下的性能表现，通带内低插入损耗有利于保持信号幅度和系统灵敏度。
三、封装与环境适应性
LFCN-530+ 为 SURF MT（表面贴装）封装，便于自动贴片与回流焊流程，适合体积受限的 PCB 布局。宽温工作范围确保其可在工业、航天和通信基站等恶劣环境中长期稳定工作。产品符合 RoHS 要求，有利于符合环保与可靠性规范的产品设计。
四、典型应用场景
- 射频前端的杂散抑制与基带前滤波（抗混叠）
- 无线通信收发器的接收链/发射链信号整形
- 测试测量设备中的频谱净化与带宽限制
- MIL/工业电子系统中对高频干扰的抑制
五、集成与选型建议
- 在 50Ω 系统中直接使用可实现最佳匹配，布线应尽量保持同轴/微带传输线的特性阻抗一致，以避免反射。
- 对于临近器件可能产生的寄生电容与感抗，应在 PCB 设计时预留足够的地平面和去耦布局，保证滤波器的实际响应接近数据表曲线。
- 若系统对截止特性或衰减斜率有更严格要求，可并联/串联其他滤波单元或采用有源均衡电路以优化群延迟与滤波性能。
- 在高功率或高温应用中，确认热设计满足器件最大允许功率与环境温升要求。
六、注意事项与资料获取
在最终设计前，建议参考 Mini-Circuits 的正式数据手册与 S-参数文件以获得完整的频率响应、群延迟和功率承受能力等信息。实际应用时，应进行板级测试以验证插入损耗、回波损耗和阻抗匹配情况，确保系统性能达到预期。若需替代型号或批量采购，可联系供应商获取最新交期与认证资料。
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