WMSIC Electronic Components

Mini-Circuits NCS1.5-232+

ModelNCS1.5-232+
PackageSMD-6P,2x1.3mm
BrandMini-Circuits
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Mini-Circuits NCS1.5-232+
Type
MINI-CIRCUITS
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MINI-CIRCUITS
Electronic Component
NCS1.5-232+
Electronic Component
1
Electronic Component
1.23mm
Package
SMD-6P,2x1.3mm
Electronic Component
(balun)
Electronic Component
0.017g
Electronic Component
2mm
Electronic Component
0.84mm
Electronic Component
8°
Electronic Component
1
Electronic Component
BM0264880922
Operating Temperature
55℃~+100℃
Frequency
400MHz~2.3GHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

NCS1.5-232+ 产品概述

NCS1.5-232+ 是 Mini-Circuits 提供的一款表面贴装射频变压器(RF Transformer / Balun),用于在射频链路中实现阻抗变换、平衡/不平衡信号转换与信号调节。器件体积小巧、工作频带宽,适合紧凑的高频模块与无线通信终端设计,支持 RoHS 要求,采用 SMD-6P 小封装,便于自动化贴装与批量生产。

一、主要性能参数

  • 频率范围:400 MHz ~ 2.3 GHz
  • 阻抗比(不平衡 / 平衡):1 : 1.5
  • 插入损耗(最大值):1.6 dB
  • 相位差(典型/最大):8°(给定)
  • 幅度差(最大值):0.9 dB
  • 回波损耗(最小值):11.76 dB
  • 工作温度:-55 ℃ ~ +100 ℃
  • 尺寸(典型):长 2.00 mm × 宽 1.23 mm × 高 0.84 mm
  • 封装:SMD-6P,封装外形约 2 × 1.3 mm
  • RoHS:符合环保无铅要求

二、功能与适用场景

NCS1.5-232+ 的设计目的是在宽带频段内提供可靠的阻抗变换和平衡/不平衡转换,常见的应用场景包括:

  • 无线通信收发前端中的滤波器与混频器接口匹配;
  • 天线耦合与差分信号驱动(尤其是在需要将单端信号转换为差分输入的场合);
  • 接收机低噪放大器(LNA)与下变频链路的平衡化处理;
  • 宽带测试板与射频模块的信号调节与隔离;
  • 软件定义无线电(SDR)、基站小型化模块、无线传感器节点等对体积和频带有要求的装置。

三、关键电性能解读

  • 频率覆盖 400 MHz 到 2.3 GHz,覆盖常见的 GSM、UMTS、LTE、Wi-Fi 与 ISM 频段,适合多种无线标准的中低频段应用。
  • 1:1.5 的阻抗比提供了非整数的阻抗变换能力,便于在差分/单端器件间进行匹配,帮助改善链路的功率传输与反射性能。
  • 最大插入损耗 1.6 dB 表明器件在通带内对信号的衰减较小,有利于系统增益预算。
  • 幅度差最大 0.9 dB、相位差约 8°,表明器件在平衡输出时具有良好的幅相匹配度,适合对差分性要求不极端但需要一致性的应用。
  • 回波损耗 ≥ 11.76 dB 表示输入/输出端口在所述频带内具有可接受的匹配性能,能降低反射对系统稳定性的影响。

四、机械与封装优势

  • 微小的 SMD-6P 封装(约 2 × 1.3 mm)适合空间受限的射频模块与多层 PCB 设计。
  • 表面贴装方式支持常见的回流焊工艺,便于与自动化 SMT 组装线衔接。
  • 推荐在 PCB 布局中尽量缩短信号路径、合理布置接地与过孔,以维持器件的射频性能并降低寄生影响。

五、设计与使用建议

  • 布局:将变压器靠近关键器件(如放大器、混频器或滤波器)放置,最短化传输线长度,使用连续接地平面并在接地处配置足量过孔以减小寄生电感。
  • 匹配:若目标端口要求更严格的回波损耗或特定阻抗(如 50 Ω 差分),可结合微带线或元件进行微调匹配。
  • 测试验证:在样件评估阶段建议测量器件的 S 参数(S11、S21、S22)和差分相位/幅度失配,以确认在板级真实环境下的表现。
  • 温度与可靠性:器件额定工作温度范围宽(-55 ℃ 至 +100 ℃),适合工业级应用,但如需在更极端环境或高功率条件下使用,请参考厂商数据手册或进行额外验证。

六、优势概述与选型注意

NCS1.5-232+ 的主要优势在于宽频带覆盖、紧凑封装与较好的幅相匹配,适合对体积敏感且需求多频段支持的射频系统。选型时应注意目标系统的阻抗需求、最大可接受插入损耗与幅相平衡要求,并在板级实现中关注 PCB 布局与接地设计以发挥器件的最佳性能。

总结:NCS1.5-232+ 是一款针对宽带信号调节与差分/单端转换的高性价比 SMD 射频变压器,适用于多种无线通信与测试应用。为获得最佳效果,建议在设计早期进行板级仿真与样机测试,并参考 Mini-Circuits 的详细数据手册以确认全部电气与机械限制。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.