WMSIC Electronic Components

Mini-Circuits TT1-6-KK81+

ModelTT1-6-KK81+
PackageSMD-6
BrandMini-Circuits
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

17 specifications

Core information

Product name
Mini-Circuits TT1-6-KK81+
Type
MINI-CIRCUITS
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MINI-CIRCUITS
Electronic Component
TT1-6-KK81+
Electronic Component
1
Package
SMD-6
Electronic Component
(balun)
Electronic Component
1.5g
Electronic Component
1
Electronic Component
BM0265000510
Operating Temperature
20℃~+85℃
Frequency
4kHz~300MHz
Electronic Component
Electronic Component
Electronic Component
1000
Electronic Component
3dB

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TT1-6-KK81+ 产品概述

一、概述

TT1-6-KK81+ 为 Mini-Circuits 出品的一款宽频带射频变压器,采用 SMD-6 表面贴装封装,设计用于 HF/VHF 频段的阻抗匹配与天线平衡处理。器件覆盖极宽的频率范围(4 kHz 至 300 MHz),在整个带宽内保持稳定的传输特性和良好的回波损耗,适合需要宽带一致性与紧凑封装的无线电、通信及测试设备。

二、主要电气参数

  • 频率范围:4 kHz ~ 300 MHz
  • 插入损耗(最大):3 dB
  • 工作温度:-20 ℃ ~ +85 ℃
  • 返回损耗:设计上具有良好回波抑制,适合宽带匹配应用

三、性能特点

  • 宽频带覆盖:从低频到 VHF 的连续响应,便于单器件实现多段频谱支持。
  • 低插入损耗:最大 3 dB,保证在大多数匹配和馈线转换场合中的能量传输效率。
  • 良好回波特性:在目标频段内保持较低反射,提升系统吞吐与接收灵敏度。
  • SMD-6 小型封装:便于表面贴装生产流程和高密度 PCB 布局。

四、典型应用

  • 短波/业余无线电(HF)和 VHF 收发机的阻抗匹配与平衡馈线转换。
  • 宽带接收前端与发射链路中的隔直/阻抗隔离元件。
  • 无线基础设施、测试测量仪器及便携式无线终端等对体积和带宽有要求的场合。

五、封装与环境指标

  • 封装形式:SMD-6(表面贴装)
  • 工作温度范围:-20 ℃ ~ +85 ℃
  • 推荐采用标准回流焊工艺装配,请在 PCB 布局时预留足够的焊盘与热散布路径,确保焊接可靠性。

六、安装与使用建议

  • 在设计时靠近天线或馈线入口放置以减少不必要的传输线损耗与失配。
  • 注意器件方向与焊盘极性(如适用)以保证平衡/不平衡端正确连接。
  • 如需在极端温度或高功率工作条件下使用,建议与 Mini-Circuits 技术资料或应用工程师确认具体限制。

七、注意事项与采购

  • 选型时请确认系统目标阻抗、工作频段与功率等级,以确保器件在实际工况下满足性能要求。
  • 型号:TT1-6-KK81+,品牌:Mini-Circuits,封装:SMD-6。
  • 采购或批量应用前,推荐参考制造商完整数据手册以获取更详细的 S 参数、封装尺寸与焊接工艺要求。

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