WMSIC Electronic Components

Mini-Circuits HFCN-1200+

ModelHFCN-1200+
PackageSMD-4P,3.2x1.6mm
BrandMini-Circuits
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Mini-Circuits HFCN-1200+
Type
MINI-CIRCUITS
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MINI-CIRCUITS
Electronic Component
HFCN-1200+
Electronic Component
1
Package
SMD-4P,3.2x1.6mm
Electronic Component
RFFilter
Electronic Component
40dB;20dB
Electronic Component
0.103g
Electronic Component
50Ω
Electronic Component
1
Electronic Component
BM0265000513
Operating Temperature
55℃~+100℃
Frequency
1.18GHz
Electronic Component
2dB
Filter Type
Electronic Component
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HFCN-1200+ 产品概述

一、产品简介

HFCN-1200+ 是 Mini-Circuits 提供的一款表面贴装高通滤波器(HI PASS FLTR / SURF MT),设计用于50Ω射频系统的频率选择与信号调理。其截止频率约为 1.18 GHz,标准阻抗 50Ω,典型插入损耗约 2 dB,适用于宽带射频链路中对低频成分的抑制与高频信号的通带保真。器件为 SMD-4P 封装,外形尺寸 3.2 x 1.6 mm,符合 RoHS 环保规范,工作温度范围 -55℃ 至 +100℃。

二、主要特性

  • 类型:高通滤波器(HPF)
  • 截止频率:1.18 GHz(约)
  • 阻抗:50 Ω 匹配
  • 插入损耗:典型约 2 dB(通带)
  • 封装:SMD-4P,尺寸 3.2 × 1.6 mm,适用于自动化贴装
  • 环境与可靠性:RoHS 合规,工作温度 -55℃ 至 +100℃
  • 应用形态:表面贴装,便于批量生产与小型化产品集成

三、典型应用

  • 蜂窝基站及用户终端的射频前端,抑制低频干扰与近端耦合
  • 无线局域网(Wi‑Fi)、蓝牙等民用无线设备的滤波与隔离
  • 雷达、导航与卫星通信系统的频谱整形
  • 测试测量设备中的信号链保护与带通前置滤波
  • 混频器、LNA、功分器/合路器前后的干扰隔离与谐波清除

四、布局与安装建议

  • 保持器件与相邻射频接口的引线最短,以降低串扰与寄生电感影响。
  • 在滤波器周围使用连续接地面并增加过孔接地(ground vias),减少底板回流路径和辐射。
  • 设计走线时严格控制 50Ω 特性阻抗,避免阻抗突变引起反射。
  • 采用厂家推荐的焊盘轮廓与焊膏量,配合标准回流工艺,可保证可靠焊接;清洗时选用对金属和封装无害的溶剂。
  • 敏感应用建议在滤波器进出口处增加浪涌与静电保护电路,防止瞬态损伤。

五、设计注意事项

  • 在最终设计前,应参考 Mini‑Circuits 的详细数据手册与频率响应曲线(插入损耗、回波损耗与群延迟随频率变化),以保证通带性能满足系统要求。
  • 对功率处理能力、线性度(如 IP3)以及在极端温度下的参数漂移,需基于应用场景进行评估与实测确认。
  • 若系统对相位线性或极低插损有严格要求,应在板级验证中测量滤波器实际性能并根据结果调整匹配网络或选择更高规格器件。

六、物料与可靠性管理

HFCN-1200+ 为小尺寸表贴器件,适合高密度布局的量产要求。器件满足 RoHS 环保要求,建议在生产过程中遵守元器件储存、焊接和测试规范,避免超温回流或长期高温环境导致性能退化。对长期可靠性或军工级应用,可与供应商确认额外的寿命或加速老化测试数据。

七、总结

HFCN-1200+ 以其 1.18 GHz 的截止特性、50Ω 匹配和小型封装,为射频前端提供了一种体积小、易装配且适用于宽频段的高通滤波解决方案。通过合理的 PCB 布局与匹配设计,可在移动通信、无线局域网、雷达与测试设备等多种场景中实现稳定的低频抑制与高频信号传输。欲获取完整频率响应曲线与电气参数建议参考 Mini‑Circuits 官方数据手册。

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