Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Mini-Circuits HFCN-1810+
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- Mini-Circuits HFCN-1810+
- Type
- MINI-CIRCUITS
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MINI-CIRCUITS
- Electronic Component
- HFCN-1810+
- Electronic Component
- 1
- Package
- SMD3216-4P
- Electronic Component
- 2800MHz
- Electronic Component
- Filter
- Electronic Component
- 1g
- Electronic Component
- 50Ω
- Electronic Component
- 1
- Electronic Component
- BM0229987749
- Operating Temperature
- 55℃~+100℃
- Electronic Component
- 2dB
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
HFCN-1810+ 产品概述
一、概述
HFCN-1810+ 是 Mini-Circuits 出品的宽带高通滤波器，面向射频信号调节与系统隔离应用。器件采用 SMD3216-4P 表面贴装封装，专为 50Ω 系统设计，适配现代无线基站、有线宽带与测试测量设备的紧凑布局需求。
二、主要参数
- 带宽：2800 MHz（覆盖宽频段信号传输）
- 插入损耗：2 dB（典型值，表示通过滤波器的能量损耗低）
- 阻抗：50Ω（与常见射频链路匹配）
- 工作温度：-55℃ ~ +100℃（适应工业级环境）
- 封装：SMD3216-4P（3.2 × 1.6 mm 级别，便于高密度 PCB 布局）
三、性能特点
- 宽带低损耗：在指定带宽内保持低插入损耗，减少信号衰减，保证增益链路性能。
- 尺寸小、易贴装：SMD 封装适合自动回流焊和高密度板级集成。
- 宽温工作：工业级温漂控制，适合室外或高温设备使用。
- 与 50Ω 系统原生匹配，简化阻抗匹配设计。
四、典型应用
- 有线电视（CATV）与 HFC 网络的上/下行隔离与整形
- 宽带接入与分配放大器信号调节
- 无线通讯前端滤波，防止低频干扰进入接收链
- 射频测试与测量设备中的参考滤波单元
五、PCB 布局与使用建议
- 尽量缩短输入/输出走线，保持端口与滤波器引脚直连以降低寄生。
- 在器件两侧布置过孔和大面积地平面以改善接地和散热。
- 遵循厂商回流曲线进行焊接，避免过热导致性能退化。
- 需确认系统中最高输入功率与器件承受能力（详见厂商数据手册）。
六、选型与注意事项
- 在最终选型前，建议参考 Mini-Circuits 官方数据手册以获取 S-参数、功率承受、群时延等详尽指标。
- 若有更窄带或不同截止频率需求，可咨询厂商或选择同系列不同型号以匹配具体频段。
如需完整数据表、S参数文件或 PCB 封装库（GERBER/3D），可联系 Mini-Circuits 或授权代理获取官方资料。
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Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
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Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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