Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Mini-Circuits LFCN-113+
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Mini-Circuits LFCN-113+
- Type
- MINI-CIRCUITS
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MINI-CIRCUITS
- Electronic Component
- LFCN-113+
- Electronic Component
- 1
- Package
- SMD-4P,3.2x1.6mm
- Electronic Component
- 0MHz~10800MHz
- Electronic Component
- Filter
- Electronic Component
- 20dB
- Electronic Component
- 0.11g
- Electronic Component
- 50Ω
- Electronic Component
- 1
- Electronic Component
- BM0264880917
- Operating Temperature
- 55℃~+100℃
- Frequency
- 12.25GHz
- Electronic Component
- 0.11dB
- Filter Type
- Filter
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LFCN-113+ 产品概述
一、主要参数
LFCN-113+ 是 Mini-Circuits 出品的一款表面贴装型低通滤波器（LOW PASS FLTR / SURF MT / RoHS）。主要电气与环境参数如下：
- 截止频率（Fc）：12.25 GHz
- 插入损耗：0.11 dB（典型）
- 特征阻抗：50 Ω
- 工作温度范围：-55 ℃ 至 +100 ℃
- RoHS 合规，适用于表面贴装工艺
二、关键特性
- 高频截止点精确，适合微波频段的带外抑制与基带保真。
- 极低插入损耗，保证信号通过时的幅度损耗最小化，有利于维持系统噪声系数与增益平衡。
- 标准50 Ω 匹配，方便与常见射频链路、同轴与微带传输线直接对接。
- 宽温度范围，适用于工业级和部分航天/国防类环境需求。
- 表面贴装封装便于自动化SMT生产与高密度板级集成。
三、典型应用场景
- 无线通信收发前端的基带与中频滤波，抑制高次谐波与带外干扰。
- 射频测试与测量系统中的信号调理模块，提升测量精度与重复性。
- 雷达、卫星通信、航空电子与工业微波系统中对带外噪声、互调产物的抑制。
- 高频电路原型与量产板级设计，作为级间滤波或终端保护元件使用。
四、使用与安装建议
- 贴装时建议按厂家推荐的焊盘尺寸与回流曲线进行，以保证良好焊接和电气性能。
- 为维持50 Ω特性，滤波器应尽量靠近信号源或敏感器件布置，输入输出通过短且恒阻抗的走线连接。
- 紧邻滤波器地线处应做好地平面与过孔处理，降低寄生共振与辐射。
- 在要求严苛的环境（如高温循环或振动）下，应做可靠性验证；建议在最终系统中测试插入损耗与相位响应是否满足指标。
- 注意静电防护与正确存储，避免潮湿环境长时间暴露造成焊接或性能问题。
五、总结与选型建议
LFCN-113+ 以其12.25 GHz 的截止频率、极低插入损耗和宽工作温度范围，是微波与射频系统中用于带外抑制与信号调理的优选滤波器。对于需要在50 Ω链路中实现高保真传输且对带外干扰有严格控制的应用，LFCN-113+ 能提供良好的性能与板级集成便利。如需进一步确认相位特性、阻抗回波损耗或更详细的封装尺寸与焊盘推荐，请参考 Mini-Circuits 的数据手册或联系供应商获取样片与规格书。
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