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Mini-Circuits LFCN-9170+
Configuration
1 options
Configuration
24+
Available for RFQ
Technical data
Product details
16
specifications
Core information
- Product name
- Mini-Circuits LFCN-9170+
- Type
- MINI-CIRCUITS
- Minimum package
- 1000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MINI-CIRCUITS
- Electronic Component
- LFCN-9170+
- Electronic Component
- 1
- Package
- SMD3216-4P
- Electronic Component
- Filter
- Electronic Component
- 0.114g
- Electronic Component
- 50Ω
- Electronic Component
- 1
- Frequency
- 9.8GHz
- Electronic Component
- BM0265000484
- Electronic Component
- Electronic Component
- Electronic Component
- 1000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LFCN-9170+ 产品概述
一、产品简介
LFCN-9170+ 为 Mini-Circuits 提供的一款紧凑型陶瓷射频滤波器，设计用于 50Ω 系统，标称工作频率点接近 9.8 GHz。采用 SMD3216-4P 表面贴装封装，体积小、可靠性高，适配现代高密度射频前端模块与微波器件集成需求。该器件以稳定的陶瓷介质与成熟工艺为基础，兼顾频率选择性与封装一致性，便于大批量装配与现场维护。
二、核心参数与特性
- 标称中心/工作频率：约 9.8 GHz，适用于微波频段的窄带或带阻/带通应用（以厂家最新数据表为准）。
- 阻抗：50Ω 匹配设计，便于与常见射频链路直接耦合。
- 封装：SMD3216-4P（片式封装，约 3.2 × 1.6 mm 外形），适合回流焊工艺。
- 材料与工艺：陶瓷介质结构，具有良好的温稳性和长期频率稳定性。
- 性能优势：体积小、温度漂移小、重复性与一致性高，便于在功耗受限或空间受限的子系统中使用。
三、结构与封装说明
SMD3216-4P 为标准化表面贴装封装，四端口/四焊盘布局利于稳定的电气连接与良好地平衡接地。陶瓷本体在高频下呈现低损耗特性，适合频段到 10 GHz 量级的应用。封装兼容自动贴装与回流焊流程，便于生产线无缝集成。
四、典型应用场景
- 微波通信与无线回传链路前端滤波与镜像抑制。
- 雷达子系统与测距设备中的带通/带阻频率选择。
- 卫星通信与航天载荷的紧密射频链路。
- 测试测量设备、频谱分析前端的杂散抑制与有源器件保护。
- 多频段射频模块中用于子带隔离与滤波器组合设计。
五、布局与使用建议
- 保持 50Ω 传输线阻抗连续，输入输出端尽量减少不必要的过孔与走线急弯。
- 器件周围建议提供完整接地平面与回流焊接地焊盘，确保信号完整性与散热性能。
- 采用推荐的回流曲线进行焊接，避免过高温度或过长加热时间以保护陶瓷结构。
- 对于灵敏接收链路，建议在板级进行阻抗校准与滤波器性能验证；若需严格指标（插入损耗、驻波、带外抑制等），请参照厂家数据表并在目标板上进行实测。
六、采购与技术支持
LFCN-9170+ 属 Mini-Circuits 系列产品，建议通过官方渠道或授权经销商采购以保证正品与完整数据支持。购买前请索取最新版 datasheet 与 S-参数文件（Touchstone），以便在仿真与版图设计中精确使用。若需替代器件或定制化参数，建议与厂商工程师沟通确认。
备注：本文基于所给基础参数（中心频率约 9.8 GHz、阻抗 50Ω、陶瓷滤波器、SMD3216-4P、Mini-Circuits）整理，具体电气性能与机械尺寸应以 Mini-Circuits 官方数据表为准。
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