WMSIC Electronic Components

Mini-Circuits TC1-1TX+

ModelTC1-1TX+
PackageSMD,3.8x3.8mm
BrandMini-Circuits
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

16 specifications

Core information

Product name
Mini-Circuits TC1-1TX+
Type
MINI-CIRCUITS
Unit
Electronic Component
Minimum package
2000

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MINI-CIRCUITS
Electronic Component
TC1-1TX+
Electronic Component
1
Package
SMD,3.8x3.8mm
Electronic Component
RFOther ICand Module
Electronic Component
0.163g
Frequency
400kHz~500MHz
Electronic Component
1
Electronic Component
BM0265000495
Operating Temperature
40℃~+85℃
Electronic Component
2000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TC1-1TX+ 产品概述

一、产品概要

TC1-1TX+ 是 Mini-Circuits 推出的一款表面贴装信号/音频变压器,设计用于宽频带的阻抗变换和隔离场合。器件工作频率覆盖 400 kHz 至 500 MHz,工作温度范围为 -40 ℃ 至 +85 ℃,符合 RoHS 要求,适合商用与工业级电子系统的长期运行。产品以紧凑的 SMD 形式供货,便于SMT贴片和回流焊工艺,实现高密度板级集成。

二、主要特性

  • 宽频带覆盖:从低频音频段(kHz)延展到 VHF 频段(数百 MHz),可支持多种信号类型的传输与耦合。
  • 等匝比(1:1)设计:电压/电流比接近 1:1,便于做隔离、阻抗匹配或平衡/不平衡之间的转换。
  • 表面贴装工艺:适用于自动化组装,减少手工焊接引入的可靠性风险,提升生产效率。
  • 宽温度稳定性:-40 ℃ 至 +85 ℃ 的额定工作温度,符合工业级环境需求。
  • 符合环保标准:RoHS 兼容,满足环保与法规合规要求。

三、典型电气与机械特点(摘要)

  • 频率响应:400 kHz ~ 500 MHz,表现为在该范围内维持良好的耦合和阻抗转换能力。
  • 功能定位:信号隔离、共模抑制、阻抗匹配、差分信号转换等。
  • 引脚和封装:采用表面贴装封装(具体封装尺寸请参照 Mini-Circuits 官方数据手册和封装图);便于与 PCB 级联并减少寄生电感、寄生电容影响。
  • 可靠性:适配工业环境的温度循环与热冲击要求,长期寿命表现稳定。

(注:若用于严格的系统设计,请参照厂方完整规格书以获取详细的插入损耗、回波损耗、直流电阻、额定功率和封装尺寸等精确参数。)

四、典型应用场景

  • 射频前端与中频级:用于低噪声放大器(LNA)、混频器和滤波器之间的阻抗变换与隔离。
  • 音频与宽带讯号耦合:在需要隔直流、保留低频成分的场合(如音频复用、传感器前端)表现良好。
  • 网络分析与测试仪器:作为信号注入或提取元件,提供低失真耦合。
  • 工业与通信设备:适用于无线基站、收发模块、射频模块等对体积与一致性要求高的模块化设计。

五、封装与安装建议

  • PCB 布局:靠近信号链路放置以降低走线长度与寄生影响;保持信号线对地回流路径连续,避免形成环路引入干扰。
  • 焊接工艺:推荐采用标准回流焊曲线,遵循厂方的温度限制与焊接说明,避免过高的温度峰值或过长的加热时间。
  • 机械固定:在高振动环境中,应注意周边器件的固定与阻尼处理,以防机械应力对焊点和引脚造成破坏。

六、使用注意事项与合规性

  • 性能验证:在关键应用前,建议在目标板上进行带宽、插入损耗、回波损耗和相位响应等实测,以确认匹配系统需求。
  • 电气限制:避免将器件用于超出其额定频率或电平的输入,否则可能引起非线性失真或过热。
  • 合规资料:TC1-1TX+ 满足 RoHS 要求;如需 UL、REACH 或其它认证信息,请向供应商或 Mini-Circuits 获取最新合规文件与检验报告。

总结:TC1-1TX+ 是一款面向宽频带信号处理的紧凑型表贴变压器,适合需要稳定隔离与阻抗转换的射频与音频系统。用于设计时请结合厂方完整规格书与评估板测试结果,确保在目标应用中达到期望的性能与可靠性。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.