WMSIC Electronic Components

Mini-Circuits SCN-2-22+

ModelSCN-2-22+
PackageSMD-6P,3.2x1.6mm
BrandMini-Circuits
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

16 specifications

Core information

Product name
Mini-Circuits SCN-2-22+
Type
MINI-CIRCUITS
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MINI-CIRCUITS
Electronic Component
SCN-2-22+
Electronic Component
1
Package
SMD-6P,3.2x1.6mm
Electronic Component
RF Power Divider / Combiner
Electronic Component
1g
Frequency
1.85GHz~2.2GHz
Electronic Component
1
Electronic Component
BM0264880916
Electronic Component
0.5dB
Electronic Component
Electronic Component
Electronic Component
1000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SCN-2-22+ 产品概述

一、产品简介

SCN-2-22+ 是 Mini-Circuits 提供的一款双路射频功率分配/合并器(PWR SPLTR / CMBD),工作频率覆盖 1.85 GHz 至 2.2 GHz,标称插入损耗约 0.5 dB,并符合 RoHS 要求。该器件用于在 50Ω 射频系统中实现信号的均匀分配或多路信号的合并,适用于对损耗敏感且频段集中在 1.9 GHz 左右的应用场景。

二、主要特性与优势

  • 低插入损耗:0.5 dB 的低损耗特性,有助于在分配或合并过程中最大限度降低能量损失,提高系统效率。
  • 指向性与隔离:作为专业级分配/合并器,设计上兼顾了端口之间的隔离与稳定性(详细隔离与相位平衡等参数请参阅原厂数据手册)。
  • 紧凑可靠:Mini-Circuits 一贯的模块化、工艺成熟的设计,适合在有限空间内集成使用并长期稳定工作。
  • 合规环保:器件符合 RoHS 标准,利于产品的法规合规与环境友好型设计。

三、典型应用场景

  • 蜂窝通信基站:用于天线合并、功放输出合路或分路测试链路中,适配 1.9 GHz 左右频段的应用。
  • 射频测试与量测平台:作为测试台架上的分配/合并模块,便于信号路由和功率测量。
  • 多天线系统与多路复用:用于天线馈线分配、发射链路合并或接收链路分配,帮助系统实现功率均衡。
  • 实验室与研发:在射频原型验证与模块评估中,用于快速搭建分配/合并网络。

四、使用建议与注意事项

  • 阻抗匹配:请在 50Ω 体系下使用,确保各端口匹配良好以降低反射损耗与驻波。
  • 未使用端口处理:若有未连接的端口,应使用合适阻抗的终端负载接入,避免对系统性能产生影响。
  • 功率与热管理:具体的最大输入功率与热性能请参阅官方数据手册或咨询供应商,避免在超额功率下长期工作。
  • 系统级保护:在高反射或瞬态条件下,建议配合隔离器、限幅器或吸收器使用,以保护器件和上游器件。

五、选型与获取资料

SCN-2-22+ 适合对 1.85–2.2 GHz 频段内低损耗分配/合并有严格要求的系统。为获得完整技术参数(如端口隔离、相位差、驻波比、额定功率、连接器样式及机械尺寸等),建议下载 Mini-Circuits 官方数据手册或直接联系供应商确认器件后缀与包装选项(如具体连接器类型、板上/机架安装形式等)。如需针对系统的匹配建议或替代型号比较,也可提供更详细的应用背景,我可以帮您进一步分析与推荐。

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