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Mini-Circuits ADT2-1T+
Configuration
1 options
Configuration
24+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Mini-Circuits ADT2-1T+
- Type
- MINI-CIRCUITS
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MINI-CIRCUITS
- Electronic Component
- ADT2-1T+
- Electronic Component
- 1
- Package
- SMD-6P
- Electronic Component
- (balun)
- Electronic Component
- 0.47g
- Electronic Component
- 1°
- Electronic Component
- 1
- Electronic Component
- BM0264800143
- Operating Temperature
- 20℃~+85℃
- Frequency
- 400kHz~450MHz
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Electronic Component
- 0.2dB
- Electronic Component
- 18dB
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ADT2-1T+ 产品概述
一、主要参数与性能亮点
ADT2-1T+ 为 Mini-Circuits 推出的表面贴装射频/信号变压器（RF XFMR），适用于宽带音频与射频信号的平衡/不平衡转换与阻抗匹配。关键参数如下：
- 频率范围：400 kHz ~ 450 MHz，覆盖音频至VHF段常用频带；
- 阻抗比（不平衡/平衡）：1:2，适合将单端信号转换为差分信号或实现阻抗变换；
- 相位差：1°（典型），保证差分输出的相位对称性；
- 幅度差（最大）：0.2 dB，确保差分幅度平衡性；
- 回波损耗（最小）：18 dB，有利于降低反射与驻波；
- 工作温度范围：-20 ℃ ~ +85 ℃；
- 封装：SMD-6P，便于自动贴装与高密度PCB设计；
- 环保与合规：RoHS 兼容。
这些性能指标表明 ADT2-1T+ 在差分平衡度、相位一致性和宽带响应上表现优异，适合对线性失真与共模抑制有严格要求的应用场景。
二、典型应用场景
- 单端到差分（SE→DE）或差分到单端（DE→SE）的转换，用于驱动差分放大器、ADC、差分放大器前端；
- 宽带阻抗匹配与隔离，在射频信号链、接收机前端和中频系统中用于改善回波损耗与反射；
- 音频与低频放大链路中用于共模噪声抑制与隔离；
- 通信设备、测试测量仪器、信号采集与分配系统等对平衡度与相位要求高的场合。
三、设计与布局建议
- PCB 布局：靠近器件的输入/输出端保持走线最短、对称，避免不必要的弯折与走多余过孔，以维持相位和幅度平衡；
- 地线与接地：SMD-6P 封装常需在器件底部或周围设地平面，保证良好接地与热散；建议按照厂商的参考封装与焊盘图设计焊盘与过孔；
- 阻抗控制：在50 Ω系统中使用时，保持输入/输出链路阻抗一致，必要时配合微带线阻抗匹配网络；
- 焊接与可靠性：采用标准SMD回流工艺，遵循厂商推荐的焊接曲线与温度限制；工作温度-20 ℃~+85 ℃，注意在高温环境下的长期漂移与寿命评估。
四、选型与采购要点
选择 ADT2-1T+ 时应确认系统带宽与阻抗需求是否与其 400 kHz~450 MHz 的性能范围匹配；若需更高频率或不同阻抗比，参考 Mini-Circuits 的其他型号。封装为 SMD-6P，适合自动化贴片生产，订购时注意完整型号及 RoHS 标识以满足环保要求。
五、总结
ADT2-1T+ 是一款面向宽带应用的高平衡度、低幅度/相位失真的表面贴装变压器，适用于差分/单端转换、阻抗匹配与共模抑制等场合。凭借 1° 相位差、≤0.2 dB 幅度差以及 ≥18 dB 的回波损耗，能在对信号完整性有较高要求的系统中提供稳定表现。推荐在设计初期结合 PCB 封装资料与制造商建议的安装工艺进行验证，确保系统性能达到预期。
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