WMSIC Electronic Components

Mini-Circuits GALI-39+

ModelGALI-39+
PackageSOT-89-4
BrandMini-Circuits
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Mini-Circuits GALI-39+
Type
MINI-CIRCUITS
Minimum package
1000 圆盘

Technical parameters

IP3
22.9dBm
P1dB
10.5dBm
Electronic Component
Electronic Component
Electronic Component
MINI-CIRCUITS
Electronic Component
GALI-39+
Electronic Component
9.8dB
Electronic Component
1
Package
SOT-89-4
Electronic Component
RFAmplifier
Electronic Component
0.001g
Frequency
0Hz~7GHz
Electronic Component
1
Electronic Component
BM69418831
Noise Figure
2.4dB
Operating Temperature
45℃~+85℃
Operating Voltage
3.1V~3.9V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GALI-39+ 产品概述

一、产品简介

GALI-39+ 是 Mini-Circuits 提供的一款表面贴装低噪声放大器(LNA),适用于直流至 7000 MHz 的宽带放大需求。器件为 50Ω 设计,封装为 SOT-89-4,小型化且便于自动贴装,适合高密度射频前端与便携式接收系统。

二、主要电气参数

  • 频率范围:DC – 7000 MHz
  • 增益:9.8 dB(典型)
  • 噪声系数:2.4 dB(典型)
  • 工作电压:3.1 V ~ 3.9 V
  • 工作电流:35 mA(典型)
  • 输出 1 dB 压缩点(P1dB):10.5 dBm
  • 输入回波损耗(S11):12.5 dB(典型)
  • 输出回波损耗(S22):14 dB(典型)
  • 三阶互调点(IP3):22.9 dBm
  • 工作温度:-45 ℃ ~ +85 ℃

三、性能亮点

GALI-39+ 在宽带范围内提供接近 10 dB 的稳定增益,同时保持较低的噪声系数(2.4 dB),对接收链灵敏度提升明显。良好的输入/输出回波损耗减少了外部匹配网络的复杂度。较高的 IP3(22.9 dBm)和 P1dB(10.5 dBm)表明该器件在面对强干扰信号时具备良好的线性性能与抗饱和能力。

四、典型应用场景

  • 无线接收前端、地面与卫星通信接收器
  • 频谱分析仪、信号监测与测试测量设备
  • 无线电传感器、遥测与物联网终端的前置放大
  • 宽带中继、RFID 和其他需要低噪声宽带放大的场景

五、推荐使用注意事项

  • 电源与退耦:建议在离器件 VCC 引脚最近处放置 0.1 μF 与 10 μF 的旁路电容,并采用适当的射频电感/馈通以抑制电源噪声。
  • 匹配与隔离:器件为 50Ω 原生匹配,若系统要求更高回波性能可辅以最小化匹配网络;输入/输出在需要时可加 DC block。
  • 热与功耗:典型耗散约为 VCC×ICC(约 3.5V×35mA ≈ 122.5 mW),虽功耗不高,但在紧凑封装与高密度 PCB 上仍需充分铜箔散热与过孔接地以保障长期可靠性。
  • 焊接与封装:SOT-89-4 可采用标准回流焊流程,焊盘与接地须按厂商推荐封装图设计,底部与周围并联接地孔可改善热路径与射频接地性能。

六、封装与可靠性

SOT-89-4 小型 SMT 封装便于批量生产与自动化贴片装配,工作温度范围宽(-45℃ 至 +85℃),适合工业与严苛环境。建议在产品验证阶段参考 Mini-Circuits 的数据手册获取完整 S 参数、稳态曲线与推荐 PCB 布局,以确保设计一次通过。

总体而言,GALI-39+ 以其宽带、低噪声与良好线性,适合对灵敏度和线性有综合要求的射频接收与前端放大应用。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.