WMSIC Electronic Components

Mini-Circuits ERA-3SM+

ModelERA-3SM+
PackageSMD-4P
BrandMini-Circuits
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Mini-Circuits ERA-3SM+
Type
MINI-CIRCUITS
Minimum package
1000 圆盘

Technical parameters

IP3
27dBm
P1dB
12.5dBm
Electronic Component
Electronic Component
Electronic Component
MINI-CIRCUITS
Electronic Component
ERA-3SM+
Electronic Component
23.4dB
Electronic Component
1
Package
SMD-4P
Electronic Component
RFAmplifier
Electronic Component
0.15g
Frequency
0Hz~3GHz
Electronic Component
1
Electronic Component
BM69418808
Noise Figure
2.6dB
Operating Temperature
45℃~+85℃
Operating Voltage
3V~3.4V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

Mini-Circuits ERA-3SM+ 产品概述

概述

Mini-Circuits ERA-3SM+ 是一款高性能的表面贴装(SMD/SMT)放大器,设计用于广泛的射频和微波应用。此款增益块在多个频率范围内(DC 到 3000 MHz)提供稳定的增益,并且具有出色的线性度和低噪声特性,使其在现代通信系统中不可或缺。这种放大器特别适合于需要高增益和可靠性的应用场景,如基站、通信设备、雷达系统和其他科研及工业设备。

主要特性

  1. 频率范围:ERA-3SM+ 支持 DC 到 3000 MHz 的工作频率范围,能够覆盖广泛的射频应用。
  2. 增益:这款增益块提供较高的增益,通常在 20 dB 左右,具体数值视工作频率而定。这使得它能有效提升信号强度,确保信号在长距离传输时仍然保持明显的清晰度。
  3. 低噪声:其低噪声特性(典型值为0.6 dB的噪声系数)确保重要信号不会被噪声淹没,适合对信号质量要求极高的应用。
  4. 输入/输出阻抗:设计中采用了50Ω的输入和输出阻抗,便于与其他RF组件的无缝连接,最大限度地减少反射和损耗。
  5. 便于集成:其SMD封装设计方便快速安装于印刷电路板(PCB)上,显著提高了生产效率,并能有效节省空间。

应用场景

  • 无线通信:在无线基站、移动通信、卫星通信和其他射频应用中,ERA-3SM+能增强信号的覆盖范围和传输质量,确保高速通信的有效性。
  • 雷达系统:该增益块在雷达应用中能有效增强返回信号的强度,提高目标检测能力。
  • 测试与测量:在各种 RF 测试设备中,ERA-3SM+ 提供了必要的增益,有助于提高测量的精确度和可靠性。
  • 科研设备:在实验室和研究场合,随着对信号增强需求的增加,这款增益块以其优越的性能,成为科研设备设计中的一项重要元件。

性能规格

以下是 ERA-3SM+ 的一些主要技术规格(请参考具体产品的数据手册以获取详细信息):

  • 型号: ERA-3SM+
  • 频率范围: DC - 3000 MHz
  • 增益: Average 20 dB (可根据频率变化)
  • 噪声系数: 0.6 dB (Typical)
  • 输入/输出阻抗: 50Ω
  • 封装形式: SMD/SMT (Surface Mount)

结论

Mini-Circuits ERA-3SM+ 是一款性能卓越的增益块,能够满足现代通信系统日益增长的需求。无论是在复杂的无线网络中,还是在高要求的科研实验室,这款增益块无疑是提升信号质量与可靠性的理想选择。凭借其高效、低噪声的特性,ERA-3SM+ 为各种应用提供了理想的解决方案,确保在不同的环境条件下都能稳定工作。对于任何希望增强射频信号的设计者来说,ERA-3SM+ 都是值得考虑的重要元件。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.