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Mini-Circuits BDCN-17-25+
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Mini-Circuits BDCN-17-25+
- Type
- MINI-CIRCUITS
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MINI-CIRCUITS
- Electronic Component
- BDCN-17-25+
- Electronic Component
- 1
- Electronic Component
- 1.6mm
- Package
- SMD-6P
- Electronic Component
- RF Coupler
- Electronic Component
- 0.12g
- Electronic Component
- 3.2mm
- Frequency
- 824MHz~2.525GHz
- Electronic Component
- 0.89mm
- Electronic Component
- 1
- Features
- Electronic Component
- Electronic Component
- BM0265000481
- Electronic Component
- 13dB
- Operating Temperature
- 55℃~+100℃
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BDCN-17-25+ 概述
一、产品简介
BDCN-17-25+ 是 Mini‑Circuits 推出的一款紧凑型射频定向耦合器，覆盖 824 MHz 至 2.525 GHz 的宽频段，主要面向 CDMA、PCS、DCS 等蜂窝通信以及一般射频监测与测量应用。器件为 SMD‑6P 无引线表贴封装，小巧、耐温、易于批量贴装，适用于基站前端、收发模块测试与功率取样等场景。
二、主要性能参数
- 频率范围：824 MHz ～ 2.525 GHz（50 Ω 系统）
- 标称耦合：17 dB（典型测量值约 18.3 ± 0.6 dB）
- 插入损耗：0.6 dB（主通路，未计耦合端）
- 回波损耗（端口匹配）：≥ 13 dB
- 功率承受：16 W（连续，视热散与系统环境需作工程校核）
- 工作温度：-55 ℃ ～ +100 ℃
- 封装尺寸：3.2 mm × 1.6 mm × 0.89 mm，SMD‑6P，表面贴装无引线结构
- 功能特性：双向耦合（可正反方向取样），50 Ω 标准
三、结构与封装特点
BDCN‑17‑25+ 采用 Mini‑Circuits 的高密度微带/同轴集成工艺，封装为 SMD‑6P 无引线表贴形式，尺寸仅 3.2×1.6×0.89 mm，便于高密度 PCB 布局与自动化贴装。无引线设计减少了寄生、电感与机械应力，对高频一致性有利。封装引脚布局用于主通、耦合和隔离端口的直接焊接，便于与 50 Ω 传输线匹配。
四、典型应用场景
- 蜂窝基站和小基站（CDMA / PCS / DCS）射频前端（功率监测、取样）
- 发射/接收链路的功率测量与故障诊断
- 无线基带和 RF 模块的生产测试、在线监控与校准
- 射频测试设备与矢量网络分析辅助取样器件
- 多频段天线系统、分布式天线系统的定向取样
五、安装与使用建议
- 建议在 50 Ω 传输系统中使用并严格控制阻抗连续性，避免产生较大反射。
- 按照常规无铅回流焊工艺（推荐 JEDEC 曲线）进行贴装，避免过高峰温或过长热敷时间。
- 贴装时注意焊盘设计与地平面，保证良好散热路径以发挥 16 W 的功率承受能力；高功率应用需在实际板级条件下做热仿真与功率降额验证。
- 出于静电保护与可靠性考虑，建议在搬运与安装过程中采取 ESD 防护措施与适当的机械固定。
- 测试时关注耦合端对接收设备的负载（应为 50 Ω 匹配）以免影响标称耦合精度。
六、选型理由与工程建议
BDCN‑17‑25+ 以其宽带性能、低插损与小尺寸封装，在要求体积受限且需可靠功率取样的移动通信设备与测试场景中具备明显优势。工程选型时应基于实际频段、允许插损和耦合精度决定是否采用该型号；若对耦合精度或隔离有更高要求，可在系统级测试中验证并考虑外部匹配或隔离措施。总体而言，该器件适合中等功率、宽带监测与生产测试环境，能为射频链路提供简洁、高效的取样解决方案。
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