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Mini-Circuits LFCN-190+
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Mini-Circuits LFCN-190+
- Type
- MINI-CIRCUITS
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MINI-CIRCUITS
- Electronic Component
- LFCN-190+
- Electronic Component
- 1
- Package
- SMD-4P,3.2x1.6mm
- Electronic Component
- RFFilter
- Electronic Component
- 0.15g
- Electronic Component
- 50Ω
- Electronic Component
- 1
- Electronic Component
- BM0264771109
- Operating Temperature
- 55℃~+100℃
- Frequency
- 280MHz
- Electronic Component
- 1dB
- Filter Type
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LFCN-190+ 产品概述
一、产品概述
LFCN-190+ 为 Mini-Circuits 出品的一款表面贴装（SURF MT）低通滤波器，针对射频/微波系统中的信号调节与带外干扰抑制而设计。该器件在 50Ω 的系统阻抗下工作，截止频率为 280 MHz，具有优秀的通带特性与稳定的插入损耗，适用于各种射频前端和测量链路的滤波需求。器件符合 RoHS 要求，适合大批量自动贴装生产。
二、主要性能参数
- 滤波类型：低通（Low Pass）
- 截止频率：280 MHz
- 系统阻抗：50 Ω
- 插入损耗：1 dB（典型）
- 工作温度范围：-55℃ 至 +100℃
- 封装形式：表面贴装（SURF MT）
这些参数确保 LFCN-190+ 在通带内保持低衰减，同时在截止频率以上有效抑制高频杂散和噪声。
三、特性与优势
LFCN-190+ 的设计侧重于低插入损耗与良好的匹配性能，能在宽温度范围内保持稳定响应。表面贴装封装方便自动化生产与紧凑 PCB 布局。RoHS 合规保证了在环保和制造合规性方面的要求。Mini-Circuits 的制造质量为长期可靠运行提供保障，适合商业与工业级应用。
四、典型应用场景
- 无线通信前端：基站、收发模块的基带/射频链路
- 信号调理：消除输入端高频干扰，保护后续放大器和 ADC
- 测试测量设备：示波器/频谱仪输入通道的抗混叠与带外抑制
- 工业与航天：在宽温度环境下的信号滤波与稳健性能需求
五、使用建议与注意事项
为保证最佳性能，建议在 PCB 布局中靠近连接器或器件放置滤波器，确保良好接地并使用适当的阻抗控制走线；在高功率或高温场景下关注器件的热耗散与额定功率限制（详见厂方数据手册）。系统匹配良好可最大限度降低反射与驻波比对插入损耗的影响。
六、认证与采购
LFCN-190+ 为 Mini-Circuits 标准产品，符合 RoHS 环保要求，适合量产采购。选型时建议参考厂方完整的器件数据手册与 S-参数文件，以便在特定频段和系统条件下进行仿真验证与频率响应评估。
如需更详细的电气特性曲线、封装尺寸图或 S 参数文件，可联系供应商或访问 Mini-Circuits 官网获取官方技术资料。
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