WMSIC Electronic Components

Mini-Circuits WP4N+

ModelWP4N+
PackageVQFN-12-EP
BrandMini-Circuits
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
Mini-Circuits WP4N+
Type
MINI-CIRCUITS
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MINI-CIRCUITS
Electronic Component
WP4N+
Electronic Component
1
Package
VQFN-12-EP
Electronic Component
RF Power Divider / Combiner
Electronic Component
0.145g
Frequency
1.215GHz~1.9GHz
Electronic Component
1
Electronic Component
BM0265000509
Operating Temperature
40℃~+85℃
Electronic Component
1.9dB
Electronic Component
Electronic Component
Electronic Component
1000
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

Mini-Circuits WP4N+ 产品概述

WP4N+ 是 Mini-Circuits 提供的一款一分四(1:4)无源功率分配/合成器,适用于 1.215 GHz 至 1.9 GHz 频段的射频/微波信号调节与分配。器件采用 VQFN-12-EP 封装,工作温度范围宽(-40 ℃ 至 +85 ℃),符合 RoHS 要求,典型插入损耗约 1.9 dB,适合对空间、成本和性能有综合要求的系统应用。

一、主要特性

  • 频率范围:1.215 GHz ~ 1.9 GHz
  • 功分/功合路数:1 分 4(单输入四输出或四输入合成单输出)
  • 典型插入损耗:1.9 dB(在标称频段内)
  • 工作温度:-40 ℃ ~ +85 ℃
  • 封装:VQFN-12-EP(带底电热垫)
  • 符合 RoHS 环保指令

二、典型应用场景

  • 基站或微基站的下行/上行信号分配与合路
  • 通信测试平台中的信号分配器/合成器
  • 多通道接收前端的功率分配与均衡
  • 无线覆盖与室内分布系统(DAS)信号路由

三、封装与安装建议

WP4N+ 采用 VQFN-12-EP 封装,底部带散热焊盘(EP),建议在 PCB 设计时:

  • 在焊盘下开设适当的热沉过孔并填充/通孔以改善热传导;
  • 严格按照厂商推荐的 PCB 焊盘图和回流焊曲线进行焊接,以避免热应力破坏器件;
  • 在高功率或连续工作场景下,考虑在器件底部和周围做额外散热处理。

四、设计与使用注意事项

  • 功率额定(峰值/平均)和隔离、相幅平衡等详细电气参数请参照 Mini-Circuits 官方数据表;若系统对隔离或相位匹配有严格要求,请在设计阶段验证器件性能;
  • 输入/输出端口为 50 Ω 阻抗,接入系统前应确保阻抗匹配以降低反射损耗;
  • 环境温度、连续功率和驻波比(VSWR)等都会影响器件寿命和性能,需在额定范围内工作;
  • 对于关键应用,建议在样机阶段进行温度循环与长时稳定性测试。

五、维护、储运与合规

  • 存放环境建议干燥、无腐蚀性气体、避免剧烈震动;长时间存放请保持原包装防潮;
  • 器件符合 RoHS 要求,适合环保合规的量产应用;
  • 在接受与出货时建议做外观及电气抽检,确保焊盘与封装无损伤。

如需完整电气特性(隔离、相位/幅度不平衡、回波损耗、最大输入功率等)以及 PCB 焊盘、回流焊曲线和典型应用电路,请参考 Mini-Circuits 官方数据手册或联系代理商获取最新版技术文档。

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