WMSIC Electronic Components

Mini-Circuits HFCN-5500+

ModelHFCN-5500+
PackageSMD-6P,3.2x1.6mm
BrandMini-Circuits
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Mini-Circuits HFCN-5500+
Type
MINI-CIRCUITS
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MINI-CIRCUITS
Electronic Component
HFCN-5500+
Electronic Component
1
Package
SMD-6P,3.2x1.6mm
Electronic Component
RFFilter
Electronic Component
0.15g
Electronic Component
50Ω
Electronic Component
1
Electronic Component
BM0265000493
Operating Temperature
55℃~+100℃
Frequency
5.5GHz
Electronic Component
2dB
Electronic Component
6GHz~11.5GHz
Filter Type
Electronic Component
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HFCN-5500+ 产品概述

一、产品简介

HFCN-5500+ 是 Mini-Circuits 推出的一款高性能表面贴装高通滤波器(HI PASS FLTR),专为微波与射频信号调节设计。该器件针对 50Ω 系统优化,提供从绝对带宽 6 GHz 到 11.5 GHz 的通带性能,并在 5.5 GHz 处表现为截止(cutoff)特性。器件以 SURF MT(表面贴装)封装形式供货,符合 RoHS 环保要求,适合高密度 PCB 集成应用。

二、主要技术参数

  • 型号:HFCN-5500+(Mini-Circuits)
  • 类型:高通滤波器(Surface Mount)
  • 截止频率(cutoff):5.5 GHz
  • 绝对带宽(通带):6 GHz ~ 11.5 GHz
  • 阻抗:50 Ω
  • 工作温度范围:-55 ℃ ~ +100 ℃
  • 环保合规:RoHS 兼容
  • 封装形式:表面贴装(SURF MT)

注:有关插入损耗、回波损耗(VSWR)及阻带抑制等详细频率响应曲线,请参见厂商数据手册以获得基于实验测量的定量参数。

三、关键特性与优势

  • 针对 6–11.5 GHz 频段优化的通带响应,适用于宽带微波信号通过与清理。
  • 在 5.5 GHz 附近具有明确的截止特性,能有效抑制低于截止频率的干扰与镜频成分。
  • 50Ω 标准阻抗匹配,便于与通用射频链路(混频器、放大器、天线接口、收发模块等)直接连接。
  • 表面贴装封装利于自动化生产与高密度电路板布局,适合量产化需求。
  • 宽工作温度范围(-55 ℃ 至 +100 ℃)保证在严苛环境下的稳定性和可靠性,适用于工业与航天级别环境。

四、典型应用场景

  • 微波/毫米波无线通信基站前端滤波与接口净化。
  • 卫星通信和雷达系统中用于上/下变频链路的高频段通带选择。
  • 频谱管理与测试设备(例如矢量网络分析仪、频谱分析仪)中的前端滤波。
  • 宽带信号链路(如无线回传、点对点微波链路)中用于抑制低频干扰。
  • 高密度射频子系统(模块化收发单元、相控阵天线单元)的内部滤波元件。

五、设计与安装建议

  • 封装为表面贴装,建议遵循 Mini-Circuits 提供的参考封装尺寸和焊盘布局进行 PCB 设计,以确保最佳电气性能和可靠的焊接质量。
  • 在安装与走线设计中,保持滤波器与相邻射频器件之间的短连接,使用 50Ω 微带或同轴过孔以保证阻抗连续性。
  • 若存在严苛的散热或机械振动条件,建议在 PCB 设计中考虑额外固定或散热措施,但通常滤波器自身为被动器件,对热量敏感性较低。
  • 避免在滤波器输入端或输出端放置可能引入低频能量的强扰源(例如未隔离的电源线、开关噪声),以免影响截止性能。
  • 推荐的回流焊工艺参数请参考厂商的焊接和回流曲线指南,遵循行业标准避免超温或过长热暴露。

六、性能验证与测试建议

  • 使用校准良好的 50Ω 矢量网络分析仪(VNA)对 S 参数进行测量,测试项目包括 S21(插入损耗/通带响应)、S11(回波损耗/驻波比)以及阻带抑制曲线。
  • 在目标工作温度范围内进行温漂测试,确认截止与通带中心频率在温度变化下的稳定性。
  • 如需在系统级评估中验证干扰抑制效果,可在整机环境下进行频谱测量或邻道干扰注入测试。
  • 对批量器件,进行抽样的环境应力筛选(如温度循环、温度湿度应力)以确认可靠性一致性。

七、环境与可靠性

HFCN-5500+ 支持工业级的工作温度(-55 ℃~+100 ℃),并符合 RoHS 环保规范,适用于对环境合规性有要求的商业与工业产品。作为被动射频元件,其长期稳定性受限于焊接质量、PCB 材料以及工作环境(温度、湿度、振动),建议在关键应用中考虑必要的可靠性验证。

八、订购信息与合规性

  • 品牌:Mini-Circuits
  • 型号:HFCN-5500+
  • 建议通过 Mini-Circuits 正规分销渠道或授权代理商采购,以获取完整的数据手册、封装图、回流焊指南及可追溯的质量保证。
  • 订购前请确认所需数量、交货期以及是否需要环境/航天级额外测试或放行文件。

总结:HFCN-5500+ 是一款为 6–11.5 GHz 工作带宽优化的表面贴装高通滤波器,兼顾宽带通带性能与工业级环境适应性,适用于通信、雷达、测试测量等多种微波系统中的信号整形与干扰抑制。更多详细电气参数和频率响应曲线,请参阅 Mini-Circuits 官方数据手册。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.