WMSIC Electronic Components

Mini-Circuits BFCG-162W+

ModelBFCG-162W+
Package0805
BrandMini-Circuits
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Mini-Circuits BFCG-162W+
Type
MINI-CIRCUITS
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MINI-CIRCUITS
Electronic Component
BFCG-162W+
Electronic Component
1
Package
0805
Electronic Component
950MHz~2200MHz
Electronic Component
Filter
Electronic Component
20dB
Electronic Component
0.023g
Electronic Component
50Ω
Electronic Component
1
Frequency
1.575GHz
Electronic Component
BM0265000508
Operating Temperature
55℃~+125℃
Electronic Component
1.8dB
Filter Type
Filter

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

Mini-Circuits BFCG-162W+ 带通滤波器产品概述

一、产品核心定位与技术基础

BFCG-162W+是Mini-Circuits推出的低温共烧陶瓷(LTCC)宽频带通滤波器,针对950MHz~2200MHz频段设计,核心聚焦GPS L1频段(1575.42MHz)的信号滤波需求,同时兼容多类无线通信、导航及工业应用。其采用LTCC工艺实现小型化与高可靠性,是射频前端滤波的高性价比解决方案。

LTCC工艺的核心优势在于:通过多层陶瓷基板叠层烧结,将滤波器的电感、电容等元件集成于内部,相比传统LC滤波器更紧凑,相比表面贴装陶瓷滤波器集成度更高;同时烧结温度低(<900℃),可兼容银电极等低成本材料,兼顾性能与成本。

二、关键性能参数及实际价值

2.1 频率覆盖与中心频点

  • 覆盖范围:950MHz~2200MHz,相对带宽约79%,可同时兼容以下常用频段:
    • 卫星导航:GPS L1(1575.42MHz)、GLONASS G1(1602MHz);
    • 无线通信:GSM 900(925960MHz)、DCS 1800(17101880MHz)、UMTS 2100(1920~1980MHz);
    • 工业无线:ISM 915MHz(868928MHz)、2.4GHz(24002483MHz);
    • 蓝牙:2.4GHz(2400~2483MHz)。
  • 中心频率:1.575GHz(与GPS L1频点精准匹配),是导航类应用的核心设计点。

2.2 插入损耗与阻抗匹配

  • 插入损耗:典型值1.8dB,在宽频带通滤波器中表现优异——低插损可减少信号能量衰减,提升射频链路接收灵敏度(如GPS接收端,插损每增1dB,灵敏度约降1dB),降低系统对前端放大器增益的要求;
  • 特性阻抗:50Ω,与绝大多数射频系统(手机、导航模块、测试仪器)阻抗匹配,无需额外转换,简化电路设计。

2.3 宽温工作范围

  • 工作温度:-55℃~+125℃,满足工业级、车载级极端环境需求(如车载导航的冬夏温差、工业现场的高低温波动);
  • 温度稳定性:LTCC陶瓷材料温度系数低,参数随温度变化小,保障宽温下滤波性能一致性。

三、封装与工艺特点

  • 封装类型:0805(英制尺寸,对应公制2.0mm×1.2mm×0.8mm),属于小型贴片封装,适配高密度PCB设计(如手机主板、车载导航模块的紧凑空间);
  • 焊接兼容性:支持回流焊、波峰焊等常规贴片工艺,适配自动化生产,降低组装成本;
  • 可靠性:LTCC多层结构无外露元件,抗振动、抗冲击能力强,符合Mini-Circuits产品的可靠性测试标准(如振动、温度循环测试)。

四、典型应用场景

  1. 卫星导航系统:GPS、GLONASS终端的射频前端滤波,抑制带外干扰(如GSM 900、UMTS 2100频段信号),提升导航定位精度;
  2. 移动终端:智能手机、平板的多频段射频模块(2G/3G、蓝牙、ISM)滤波,减少频段间干扰,优化信号质量;
  3. 车载电子:车载导航、蓝牙、车联网(V2X)的射频前端,满足-40℃~+85℃车载温区需求(远超此范围);
  4. 工业物联网(IIoT):工业无线传感器、远程监控设备的915MHz/2.4GHz ISM频段滤波,抗工业现场电磁干扰;
  5. 射频测试设备:信号发生器、频谱分析仪的滤波模块,宽频覆盖多测试频段,减少设备中滤波器数量。

五、产品优势总结

  • 宽频兼容:单器件覆盖GPS、蓝牙、2G/3G等多频段,简化系统设计(减少滤波器数量,降低PCB面积);
  • 低损高效:1.8dB插损保障信号强度,提升链路灵敏度;
  • 宽温可靠:-55℃~+125℃满足极端环境,LTCC工艺提升抗振抗冲击能力;
  • 小型化设计:0805封装适配高密度PCB,符合现代电子设备小型化趋势;
  • 成熟稳定:Mini-Circuits成熟LTCC工艺,参数一致性好,批量生产可靠性高。

该产品凭借宽频、低损、宽温及小型化优势,成为卫星导航、移动终端、车载电子等领域的实用选择。

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