Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Mini-Circuits SCN-3-28+
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
16
specifications
Core information
- Product name
- Mini-Circuits SCN-3-28+
- Type
- MINI-CIRCUITS
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MINI-CIRCUITS
- Electronic Component
- SCN-3-28+
- Electronic Component
- 1
- Package
- SMD-6P,3.2x1.6mm
- Electronic Component
- Signal Buffer / Repeater / Distributor
- Electronic Component
- 0.15g
- Electronic Component
- 1
- Channel Count
- 3
- Electronic Component
- BM0265570966
- Operating Temperature
- 55℃~+100℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SCN-3-28+ 产品概述
一、产品概述
SCN-3-28+ 为 Mini-Circuits 系列射频（RF）器件之一，面向需要三路射频通道的模块化设计场景。该器件采用 1206 表面贴装封装，适合批量化 SMT 生产并易于集成到射频前端、测试测量设备及通信基站等模块中。器件工作温度覆盖 -55℃ 到 +100℃，满足工业级及宽温应用要求。
二、关键参数
- 通道数：3（三路射频通道）
- 工作温度：-55℃ ~ +100℃
- 封装形式：1206 表面贴装（适合自动贴装与回流焊工艺）
- 品牌：Mini-Circuits
注：频率范围、插入损耗、隔离度、驻波比（VSWR）及功率处理能力等详细电性能，请以 Mini-Circuits 官方数据手册为准，设计时务必参考规范参数。
三、结构与封装特点
1206 封装在 PCB 布局上占用空间小，且具有良好的回流焊可靠性与机械强度。器件引脚布局与焊盘设计便于与标准射频传输线（微带、带状线）匹配，利于实现紧凑的射频路径和简洁的 EMI 管理。
四、典型应用场景
- 无线通信基站前端的多路分配/合路模块
- 射频测试测量设备与信号分析仪的通道选择/分配
- 卫星通信、雷达和军事通信中的紧凑型 RF 子模块
- IoT、移动设备与无线回传系统的射频子系统
五、设计与装配建议
- 在 PCB 布局时尽量缩短射频走线并采用适配的阻抗控制（通常 50Ω），以降低插入损耗与反射。
- 确认回流焊温度曲线与器件耐热性匹配，避免超出推荐热循环规范。
- 若工作在高功率或高温环境，应考虑散热措施与足够的铜箔面积以利散热。
- 在需要高隔离度或低串扰的应用，合理安排接地平面和隔离带。
六、可靠性与环境适配
器件宽温范围（-55℃~+100℃）使其适用于严苛环境和户外设备。Mini-Circuits 一贯注重器件长期稳定性与抗振动、抗冲击性能，但在极端振动或高湿环境下，建议结合封装保护与防潮措施。
七、采购与资料
购买与设计前请索取并参阅 Mini-Circuits 官方数据手册与应用说明书，获取频率响应、功率极限及焊接指南等完整参数。若有需要，可联系厂商技术支持以获得样片、评估板及参考电路，确保在目标应用中达到期望性能。
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