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Mini-Circuits LFCN-575+
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Mini-Circuits LFCN-575+
- Type
- MINI-CIRCUITS
- Minimum package
- 3000 个
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MINI-CIRCUITS
- Electronic Component
- LFCN-575+
- Electronic Component
- 1
- Package
- SMD-4P,3.2x1.6mm
- Electronic Component
- RFFilter
- Electronic Component
- 40dB；20dB；20dB
- Electronic Component
- 0.15g
- Electronic Component
- 50Ω
- Electronic Component
- 1
- Electronic Component
- BM0265570972
- Operating Temperature
- 55℃~+100℃
- Frequency
- 770MHz
- Electronic Component
- 1.2dB
- Filter Type
- Electronic Component
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LFCN-575+ 产品概述
一、产品简介
LFCN-575+ 是 Mini-Circuits 系列的表面贴装低通滤波器，设计用于在 50Ω 射频系统中对高于截止频率的信号成分进行有效抑制与整形。标称截止频率 770 MHz，插入损耗小，适用于体积受限的射频前端与中间级电路中的噪声与谐波抑制。
二、关键性能参数
- 滤波类型：低通
- 截止频率：770 MHz（-3 dB 点或厂方定义截止频率请参考官方数据表）
- 阻抗：50Ω
- 插入损耗：典型 1.2 dB
- 工作温度：-55℃ ～ +100℃
- 符合 RoHS 要求
三、结构与封装
采用 SMD-4P 封装，外形尺寸 3.2 × 1.6 mm，四焊盘表面贴装结构，便于自动化贴装与回流焊工艺。紧凑封装适合高密度 PCB 布局，可直接置于射频传输线近端以最小化寄生与反射。
四、典型应用场景
- 射频前端的谐波与带外抑制
- 无线通信收发链路的带通外泄控制与旁瓣抑制
- 射频测量与测试平台的基带整形、抗混叠处理
- 便携式与板级模块中对敏感器件的干扰隔离
五、设计与布板建议
- 采用 50Ω 传输线板级设计，滤波器两端保持阻抗连续以降低反射损耗；
- 将滤波器尽量靠近源或敏感器件放置，减少未受控走线长度；
- 地平面完整且通过足够的过孔连接，减少封装寄生；
- 遵循厂方回流焊曲线和焊盘尺寸建议，避免过量热应力。
六、测试与验证要点
在矢量网络分析仪（VNA）上测量 S21（插入损耗）与 S11（回波损耗），在目标工作带宽内确认通带性能及相位线性度。关注在温度极限和实际封装工艺后的性能漂移。
七、可靠性与合规
工作温度范围 -55℃ 至 +100℃，适配工业级应用环境。产品符合 RoHS 环保要求，适合商用及工业电子产品设计。
八、总结
LFCN-575+ 提供了体积小、插损低、温度适应范围广的低通滤波解决方案，适用于需在 50Ω 系统中抑制高频干扰、改善信号质量的场合。实际选型时建议参考 Mini-Circuits 官方数据表获取详尽的频率响应曲线与封装引脚信息，以确保在目标系统中的最佳匹配与可靠性。
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