WMSIC Electronic Components

Mini-Circuits HFCN-440+

ModelHFCN-440+
PackageSMD-4P,3.2x1.6mm
BrandMini-Circuits
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Mini-Circuits HFCN-440+
Type
MINI-CIRCUITS
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MINI-CIRCUITS
Electronic Component
HFCN-440+
Electronic Component
1
Package
SMD-4P,3.2x1.6mm
Electronic Component
RFFilter
Electronic Component
0.1g
Electronic Component
50Ω
Electronic Component
1
Frequency
440MHz
Electronic Component
BM0265570981
Operating Temperature
56℃~+100℃
Frequency
440MHz
Electronic Component
3.08dB
Electronic Component
500MHz~2.5GHz
Filter Type
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HFCN-440+ 产品概述

一、产品简介

HFCN-440+ 是 Mini-Circuits 提供的一款高通射频滤波器(High‑Pass Filter),采用表面贴装(Surface Mount)封装,符合 RoHS 要求,适用于 50Ω 射频系统的信号整形与干扰抑制。该器件设计用于在低频端实现可靠的截止特性,同时在较宽频段内保持低插入损耗,适配紧凑射频前端模块和仪器设备。

二、主要性能参数

  • 滤波类型:高通(HI PASS FLTR)
  • 截止/拐点频率:440 MHz(典型)
  • 通过带/适用频段:约 500 MHz ~ 2.5 GHz(器件在该带宽内工作性能优良)
  • 阻抗:50 Ω
  • 插入损耗:典型 3.08 dB(具体频点请参考厂商数据表)
  • 工作温度范围:-56 ℃ ~ +100 ℃
  • RoHS:符合无铅环保要求

说明:高通滤波器以 440 MHz 作为设计的截止拐点,在高于此频率的频段可提供预期的通带响应。插入损耗为代表性值,实际值随频率与电路环境略有变化。

三、封装与热、电特性

  • 封装形式:SMD-4P(表贴)
  • 尺寸:3.2 x 1.6 mm,极其适合空间受限的射频模块设计
  • 表面贴装便于自动化贴装与回流焊工艺,可靠性高
  • 室温与极端温度下均能保持稳定工作特性,适合民用与部分环境苛刻的工业/航电应用

四、典型应用场景

  • 蜂窝通信前端(滤除低频干扰、保护接收链路)
  • 无线局域网、蓝牙及其他微波链路的低频隔离
  • 射频功放前端的基带/低频噪声抑制与谐波管理
  • 射频测量设备与信号发生器中的带外噪声滤除
  • 航空航天和国防类应用(依赖器件的低温高温工作范围)

五、布局与安装建议

  • PCB 上为器件提供连续的接地平面并在器件旁做足够的地分孔(via stitching),以保证良好屏蔽与 return path。
  • 输入/输出端短引线,避免长走线和不必要的弯折,以减少寄生电感与反射。
  • 与射频连接器或同轴过渡使用阻抗匹配过渡结构,必要时在滤波器前后增加阻抗整形网络以优化 S11/S21。
  • 焊接采用推荐的回流曲线,避免过热和机械应力,参考 Mini‑Circuits 的封装与回流指南。

六、选型建议与注意事项

  • 若系统对插入损耗极其敏感,应参考设备完整的 S‑参数(S21、S11)曲线并在目标频点处评估实际损耗。
  • 对功率处理能力(平均功率与峰值)有需求的应用,请参阅原厂数据表或联系厂商获取详细额定值。
  • 若工作带宽或截止频率要求与 HFCN‑440+ 不完全一致,可在 Mini‑Circuits 产品系列中查找邻近型号以获得更优匹配。
  • 进行最终验证时,建议在目标 PCB 与实际工作温度范围下测量,以确认滤波器在系统中的综合表现。

七、总结

HFCN-440+ 是一款体积小、适用于 50Ω 系统的高通射频滤波器,凭借 440 MHz 的截止设计、在约 500 MHz~2.5 GHz 范围内的良好通带特性以及典型 3.08 dB 的插入损耗,适合紧凑射频模块、通信前端与测试设备等多种应用场景。最终选型与应用部署应结合器件 S‑参数、功率等级和实际电路布局进行验证,确保满足系统级性能要求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.