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Mini-Circuits LFCG-1400+
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Mini-Circuits LFCG-1400+
- Type
- MINI-CIRCUITS
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MINI-CIRCUITS
- Electronic Component
- LFCG-1400+
- Electronic Component
- 1
- Package
- SMD-8P,1.2x2mm
- Electronic Component
- Filter
- Electronic Component
- 1g
- Electronic Component
- 50Ω
- Electronic Component
- 1
- Electronic Component
- BM0265000487
- Operating Temperature
- 55℃~+125℃
- Frequency
- 1.65GHz
- Electronic Component
- 1dB
- Filter Type
- Filter
- Electronic Component
- Electronic Component
- Electronic Component
- 2000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LFCG-1400+ 产品概述
一、概述
LFCG-1400+ 是 Mini-Circuits 面向高频信号调节的低通滤波器，针对要求高密度封装与低损耗的射频系统设计。该器件为 SMD-8P 封装（尺寸 1.2 × 2 mm），标称工作阻抗 50 Ω，截止频率约 1.65 GHz，典型插入损耗仅 1 dB，满足苛刻的射频前端和中频滤波需求，并通过 RoHS 环保认证。
二、关键性能参数
- 滤波类型：低通滤波器
- 截止频率：1.65 GHz（近似点，具体频响请参见测试曲线）
- 典型插入损耗：1 dB（通带内低损耗，降低系统噪声与功率损失）
- 阻抗：50 Ω（系统无源匹配）
- 工作温度：-55 ℃ ~ +125 ℃（军工级/工业级温度范围）
- 封装：SMD-8P，尺寸 1.2 × 2 mm（适合高密度 PCB 布局）
- 环保：RoHS 合规
三、主要优势
- 低插入损耗：通带内仅约 1 dB 的能量损耗，有利于提升接收灵敏度与发射效率。
- 小型化封装：1.2 × 2 mm 的 SMD-8P 封装，便于在空间受限的 RF 模块、移动终端和卫星通信设备中集成。
- 宽温度适应性：-55 ℃ 至 +125 ℃ 工作温度覆盖工业与部分军规应用场景。
- 标准化 50 Ω 接口：与常用射频组件兼容，易于系统集成与阻抗匹配。
四、典型应用
- 蜂窝基站与终端射频前端（滤除带外干扰与高次谐波）
- 无线通信模组（LTE、WLAN 等子系统的射频净化）
- 射频测试与测量设备（作为前置或中频滤波器）
- ADC 前端抗混叠、收发器中的杂散抑制与信号整形
- 小型卫星及航空电子系统（对体积与温度稳定性有较高要求的场合）
五、使用建议
- 布局：滤波器尽量靠近发射/接收端器件放置，输入端与输出端走线短且同为 50 Ω 微带/带状线，以维持阻抗连续性。
- 接地：器件底部及周边提供充分的地平面与过孔，确保良好屏蔽与热散逸。
- 去耦与保护：对驱动器及敏感接收器采用合适的去耦和 ESD 保护电路，避免瞬态损坏滤波器或前后级器件。
- 验证：在最终布局中进行 S-参数测量验证，确认截止特性与插入损耗满足系统要求。
六、可靠性与封装注意
LFCG-1400+ 的小型 SMD-8P 封装便于自动贴装与回流焊，建议遵循 Mini-Circuits 的焊接指南和回流曲线以保证可靠性。器件适用宽温区间，但在极端温度循环或机械应力环境中，建议进行特定的可靠性试验验证。
总结：LFCG-1400+ 为需要在受限空间内实现 1.65 GHz 低通滤波、追求低插入损耗与宽温适应性的应用提供了紧凑且性能均衡的解决方案。欲了解更详细的频响曲线、功率处理能力与封装图纸，请参考原厂器件数据表或联系 Mini-Circuits 技术支持。
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