WMSIC Electronic Components

Mini-Circuits LFCN-1400+

ModelLFCN-1400+
PackageSMD-4P,3.2x1.6mm
BrandMini-Circuits
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Mini-Circuits LFCN-1400+
Type
MINI-CIRCUITS
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MINI-CIRCUITS
Electronic Component
LFCN-1400+
Electronic Component
1
Package
SMD-4P,3.2x1.6mm
Electronic Component
RFFilter
Electronic Component
30dB;20dB
Electronic Component
0.15g
Electronic Component
50Ω
Electronic Component
1
Electronic Component
BM0265570965
Operating Temperature
55℃~+100℃
Frequency
1.7GHz
Electronic Component
1dB
Filter Type
Electronic Component
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LFCN-1400+ 产品概述

一、产品简介

LFCN-1400+ 是 Mini-Circuits 推出的一款小型表面贴装低通滤波器,专为射频/微波信号链中的频率选择与杂散抑制而设计。该器件采用 SMD-4P 封装(尺寸 3.2 × 1.6 mm),适配 50 Ω 系统,可在宽温度范围(-55 ℃ 至 +100 ℃)下稳定工作,符合 RoHS 要求。典型应用为信号调节、基站前端、接收机前置滤波、谐波抑制与互调控制等场景。

二、主要性能与规格

  • 滤波类型:低通(Low Pass)
  • 截止频率:1.7 GHz(说明:以用户提供信息为准,实际频率特性请以厂商数据表 S-参数为准)
  • 系统阻抗:50 Ω
  • 插入损耗:典型 1 dB(视频率与匹配条件可能变化)
  • 工作温度:-55 ℃ ~ +100 ℃
  • 合规性:RoHS
  • 封装:SMD-4P,外形尺寸 3.2 × 1.6 mm(小体积、适合高密度贴片工艺)
  • 描述/用途:信号调节 / LOW PASS FLTR / SURF MT

三、典型应用场景

  • 蜂窝基站与移动终端的前端滤波与谐波抑制
  • 无线通信收发机的带外信号抑制与频率选择
  • 射频放大器与混频器前后的滤波匹配
  • 测试测量设备中的带外噪声与干扰抑制
  • ADC 前端的反混叠(anti-aliasing)与基带处理前的带宽限制
  • 小型化雷达、物联网与短距离无线链路的频谱整形

四、优势与设计要点

  • 小尺寸、SMD 封装:3.2 × 1.6 mm 的体积非常适合高密度装配,便于在空间受限的 RF 子板上布局。
  • 低插入损耗:典型 1 dB 的低损耗有助于维持系统增益与噪声系数,适合接收链与链路预算要求较高的系统。
  • 50 Ω 即插即用:与常见射频系统阻抗匹配,减少额外阻抗变换部件。
  • 宽温度稳定性:-55 ℃ 至 +100 ℃ 工作范围满足工业与航天/军工等严苛环境的要求(实际可靠性与寿命请参考厂方加速应力测试数据)。
  • RoHS 合规:符合环保与制造合规性要求。

设计建议:

  • 保持射频走线最短,尽量减少不必要的走线弯曲与过渡,以降低寄生和反射。
  • 在滤波器两侧保持 50 Ω 阻抗的过渡(微带或共面波导),避免突变引发驻波。
  • 使用连续的底层接地平面,并在滤波器附近合理布置过孔(vias)以增强接地完整性与抑制地面回路。
  • 将滤波器靠近信号源或敏感器件放置,能最大限度抑制带外干扰进入后端电路。

五、安装与可靠性注意

  • 采用标准回流焊工艺贴片安装。具体回流温度曲线、焊膏类型与湿度控制建议参照 Mini-Circuits 的装配指南与器件数据表。
  • 器件对功率承受能力、峰值功率与长期稳态功率有一定限制,设计前应确认最大可承受输入功率(Pmax)与失真指标,必要时在滤波器前后加入衰减或隔离络合器。
  • 高温回流或反复热循环可能影响性能,量产测试中建议做温度循环与射频性能抽检。

六、系统集成与测试建议

  • 在开发验证阶段使用矢量网络分析仪(VNA)测量 S21(插入损耗)与 S11(回波损耗)曲线,验证在目标频段的透过与反射性能是否满足系统要求。
  • 对群时延(group delay)、相位线性度和温漂进行评估,尤其在宽带或相位敏感应用(如相干接收、数字预失真)中需要重点关注。
  • 当滤波器用于多级滤波或与放大器串联时,确认每级的阻抗匹配和增益裕度,避免振荡与不稳定性。

七、结论

LFCN-1400+ 以其小型表贴封装、低插入损耗和工业级温度范围,适合空间受限且对带外抑制与链路损耗敏感的射频系统。作为一款 50 Ω 的低通滤波器,它在移动通信、无线接收前端、测试仪器以及多种射频子系统中具有良好的适配性。最终使用前,请参考 Mini-Circuits 官方数据表获取完整的电气参数、S-参数文件、封装图和回流焊建议,以确保设计的准确性与可靠性。

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