Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Mingda Micro MD5112
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- MD5112
- Type
- Mingda Micro
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- 70mV@(100mA)
- Electronic Component
- Electronic Component
- Electronic Component
- MD5112
- Electronic Component
- 1
- Package
- SOT-23-3L
- Electronic Component
- Linear Regulator(LDO)
- Electronic Component
- 0.017g
- Electronic Component
- 1
- Features
- Output
- Electronic Component
- BM0264548233
- Operating Temperature
- 40℃~+85℃
- Operating Voltage
- 7V
- Output
- Electronic Component
- Output Voltage
- 1.2V
- Output Current
- 300mA
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MD5112 产品概述
MD5112 是明达微（MingDaMicro）推出的一款高性能固定输出线性稳压器（LDO），面向低功耗便携和工业电子场景。器件支持正极输出，单通道输出，提供多种固定输出电压选项（1.2V～5.0V 可选），在输入电压最高约 7V 时可稳定工作，最大输出电流可达 300mA，集成丰富保护功能，适合对噪声、静态功耗和体积有严格要求的应用。
一、主要性能参数
- 输出类型：固定电压，可选 1.2V～5.0V
- 最大输出电流：300mA
- 输入电压能力：工作电压至 7V（请参见规格书确认最大输入）
- 压降（Dropout）：约 70mV @ 100mA
- 静态电流（Iq）：典型 500nA（超低静态电流，适合电池供电）
- 工作温度范围：-40℃ ～ +85℃
- 输出极性：正极
- 通道数：1
二、功能与保护特性
- 过流保护（OCP）：在过载时限制输出电流，保护器件与负载
- 短路保护：应对输出短路情形，快速响应并自动恢复
- 热关断（Thermal shutdown）：温度过高时关断输出以防损坏
- 输出放电：关断时自动放电，缩短上电/下电过渡时间
- 使能控制（EN 引脚）：外部使能信号，支持低功耗管理
三、封装信息
MD5112 提供小尺寸封装，便于空间受限应用：
- UDFN-4-EP (1x1mm) 紧凑封装（带散热焊盘）
- SOT-23-3L 传统小封装（便于手工焊接与通用PCB布局） 具体封装管脚定义与热性能请参阅器件资料书。
四、优势亮点与典型应用
优势：
- 极低静态电流，适合电池供电与待机场景
- 低压差，提升从较低电压差供电时的效率和可用电流
- 完善的保护机制，提高系统可靠性
典型应用：
- 可穿戴设备与便携式仪器
- 物联网节点、传感器供电
- 工业控制模块的低压域供电
- 电池管理与系统后备电源
五、设计与使用建议
- 输入/输出去耦：为保证稳压器稳定工作并抑制瞬态，建议在输入/输出端接近器件放置低ESR陶瓷电容（典型 1µF～10µF，具体容量与ESR 按照数据手册推荐选型）。
- 热设计：线性稳压器的功耗为 Pd = (Vin − Vout) × Iout。在高 Vin 与高 Iout 条件下可能产生较大热量（例如 Vin=5V，Vout=1.2V，Iout=300mA 时 Pd≈1.14W），须评估封装散热与PCB热铺铜。
- 启用与电源序列：利用 EN 引脚可实现电源管理和序列控制；输出放电功能可减少上电残留电压。
- 保护配合：尽管器件集成多种保护功能，仍建议在系统层面设计合理的保险与限流策略以提升可靠性。
请以 MD5112 的最新数据手册为准，获取完整的电气特性曲线、引脚定义、典型应用电路和封装机械图，以便在具体设计中准确选型与布局。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
