WMSIC Electronic Components

Mingda Micro MD7660

ModelMD7660
PackageSOP-8
BrandElectronic Component
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MD7660
Type
Mingda Micro
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MD7660
Electronic Component
1
Package
SOP-8
Electronic Component
Charge Pump
Electronic Component
0.119g
Electronic Component
1
Features
Switching Frequency
Type
Electronic Component
Electronic Component
BM0264390972
Operating Temperature
40℃~+85℃
Operating Voltage
3V~12V
Switching Frequency
10kHz
Electronic Component
94%
Output Resistor
80Ω

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MD7660 产品概述

MD7660 是明达微推出的一款高效能、低功耗的电荷泵反相/倍压转换芯片,采用 SOP-8 封装,针对空间受限且对负电源或高压微功率源需求的便携式与嵌入式系统而设计。器件支持 3V~12V 的工作电压范围,最高可耐受 12V 电压,工作温度覆盖 -40℃ 到 +85℃,在低静态电流与高能量效率之间取得良好平衡。

一、关键性能亮点

  • 工作电压:3V ~ 12V(12V 耐压设计)
  • 静态电流 (Iq):100 μA(典型,待机功耗低)
  • 输出电阻:80 Ω(等效输出阻抗,用于估算负载能力)
  • 能量效率:94%(高转换效率,适合电池供电系统)
  • 开关频率:10 kHz(自适应调节以优化效率与噪声)
  • 工作温度:-40℃ ~ +85℃
  • 功能特性:自适应开关频率;支持倍压与反相两种拓扑切换
  • 封装:SOP-8(标准易焊封装,便于 PCB 布局与散热)

二、功能与工作模式

MD7660 可在反相(产生负电压)与倍压(产生更高正电压)两种拓扑间切换,用户可根据系统需求通过外部引脚配置或控制信号选择工作模式。器件内置自适应开关频率机制,可根据负载与输入条件动态调整开关频率,降低开关损耗与电磁干扰,同时在轻载时保持极低静态电流,从而延长电池寿命。

三、典型电气特性与设计要点

  • 输出等效电阻 80 Ω 意味着在满载工况下输出电压会随负载电流有明显压降。举例:输入 5V、理想反相输出 -5V,若负载电流为 50 mA,则输出会出现较大压降,因此适合几十 mA 或更低电流的场合。
  • 推荐外部电容:泵浦电容与储能电容通常采用 1 μF 至 10 μF 低 ESR 陶瓷电容,以降低纹波与提升瞬态响应。具体容值可依据负载与纹波要求调整。
  • 对于噪声与纹波敏感的应用,建议在输入端与地之间并联较大旁路电容并采用紧凑的铺铜与短走线布局。

四、典型应用场景

  • 便携式仪器与便携式显示的负电源生成(运放负电源、LCD/EL 背光驱动偏压)
  • 传感器供电偏置与模拟前端(需要小电流负电源)
  • 低功耗数据采集与微控制器系统中的局部电压转换
  • 需要将电池电压倍压以驱动更高压器件的场合(倍压模式)

五、封装与可靠性建议

SOP-8 封装利于标准 PCB 装配及生产测试。器件工作温度范围 -40℃ 至 +85℃,适应工业级环境。为保证长期可靠性,建议:

  • 在焊接工艺中遵循厂家回流温度曲线;
  • 在高温或高负载设计中留有足够的散热铜箔;
  • 对于关键应用增加电源输入浪涌保护与反接保护电路。

六、使用建议与注意事项

  • 根据目标输出电流选择合适的外部电容与拓扑模式(反相或倍压)。
  • 在 PCB 布局时尽量缩短关键电容与芯片引脚间连线,避免走线跨越模拟敏感区。
  • 若需要更低纹波或更大输出电流,可考虑并联外部稳压或采用后级线性稳压器/降压模块配合使用。

总结:MD7660 以其低静态电流、高效率与灵活的拓扑切换特性,适合对功耗、体积和成本敏感的便携与嵌入式系统,为负电源或高压小功率源提供稳定可靠的解决方案。对于需详细典型电路与参数曲线的设计,可参考明达微的详细数据手册以获得更精确的设计数据。

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