WMSIC Electronic Components

Mingda Micro MD7533

ModelMD7533
PackageSOT-89
BrandElectronic Component
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MD7533
Type
Mingda Micro
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
45mV@(10mA)
Electronic Component
Electronic Component
Electronic Component
MD7533
Electronic Component
1
Package
SOT-89
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.159g
Electronic Component
1
Features
Electronic Component
Electronic Component
BM0264548271
Operating Temperature
40℃~+85℃@(Ta)
Operating Voltage
18V
Output
Electronic Component
Output Voltage
3.3V
Output Current
120mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MD7533 产品概述

一、概述

MD7533 是明达微(MD)基于 CMOS 工艺开发的低压差、低功耗、高精度固定输出线性稳压器,输出为正极 3.3V,单通道设计,适合对电源噪声与静态功耗要求严格的便携及工业应用。该器件内置低通态电阻晶体管,使输入输出压差极低,最高工作电压可达 18V,封装为 SOT-89,可靠性与可扩展性良好。

二、主要参数

  • 输入工作电压(最大):18V
  • 输出电压:3.3V(固定)
  • 最大输出电流:120mA
  • 压差(Dropout):45mV @ 10mA(典型,随负载增加而上升)
  • 静态电流(Iq):1.2µA(典型,适合电池供电场景)
  • 保护功能:短路保护(自动限流/热关断机制)
  • 工作温度范围:-40℃ ~ +85℃(Ta)
  • 输出通道数:1
  • 封装:SOT-89
  • 品牌:明达微

三、功能与特点

  • 低压差:在轻载时压差极小(45mV@10mA),可最大限度降低功耗和发热。
  • 超低静态电流:典型 1.2µA,适合长续航电池设备与待机场景。
  • 宽输入电压范围:最高可直接承受 18V 输入,便于与各种电源系统兼容。
  • 短路保护:内置保护机制提高系统可靠性,防止输出短路造成器件和系统损坏。
  • 固定输出 3.3V:便于为 MCU、传感器、无线模块等提供稳定电源。

四、典型应用

  • 电池供电的物联网终端、传感器节点、手持设备
  • MCU 与外围低压逻辑供电(3.3V 系统)
  • 工业控制与仪表的辅助电源
  • 精密模拟前端、低噪声电源模块

五、应用与布局建议

  • 输入/输出去耦:建议在 VIN 和 VOUT 端分别并联 1µF~10µF 的低 ESR 陶瓷电容,输出电容应靠近 VOUT 引脚放置以保证稳定性与瞬态响应。
  • 引脚连接:SOT-89 标准三引脚为 VIN、GND、VOUT(具体引脚顺序请参照最新版数据手册)。
  • 布局原则:尽量缩短电源回路与旁路电容的走线,地线通过单点或地平面处理,减少噪声干扰。

六、热设计与注意事项

线性稳压器的功耗由 Pd = (Vin − Vout) × Iout 决定。在设计时必须评估器件的功耗与封装散热能力:

  • 例如:若 Vin = 12V,Vout = 3.3V,Iout = 120mA,则 Pd ≈ (12 − 3.3) × 0.12 ≈ 1.05W。SOT-89 封装在高 Pd 条件下散热有限,长时间工作可能导致热关断或温度升高。
  • 建议在持续满载(120mA)场景下将 Vin − Vout 控制在较小范围(例如 ≤5V),或在高压差/高电流时采取散热措施(增加铜箔面积、散热片或改用开关降压后再用 LDO 做精调)。
  • 注意压差随负载增加而上升,若对输出电压精度有高要求,应参考完整的压差-负载曲线和温度特性。

七、可靠性与选型建议

  • MD7533 适用于低功耗、对尺寸和成本敏感的应用场景;在高功耗或长期高温环境下应作热评估并采取相应散热措施。
  • 选型时请结合实际负载、输入电压和环境温度,查阅明达微最新数据手册以获取完整电气特性曲线、保护阈值及引脚排列信息。

如需电路样例、压差随电流曲线或热阻模型数据,可提供进一步支持以便于系统级散热与可靠性评估。

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