WMSIC Electronic Components

Milliohm HOCR2512-2W-2KR-5% HOCR2512

ModelHOCR2512-2W-2KR-5%
Package2512
BrandMilliohm
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Milliohm HOCR2512-2W-2KR-5%
Type
MILLIOHM
Minimum package
4000 圆盘

Technical parameters

Power
2W
Electronic Component
Electronic Component
Electronic Component
MILLIOHM
Electronic Component
HOCR2512-2W-2KR-5%
Electronic Component
1
Package
2512
Electronic Component
SMD Resistor
Electronic Component
±5%
Electronic Component
0.053g
Electronic Component
2kΩ
Electronic Component
1
Electronic Component
BM0265617066
Operating Temperature
55℃~+155℃
Operating Voltage
250V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HOCR2512-2W-2KR-5% 陶瓷贴片电阻产品概述

一、产品基本属性与核心参数

HOCR2512-2W-2KR-5%是Milliohm(毫欧)品牌推出的陶瓷功率贴片电阻,核心参数明确匹配中等功率、宽温适应性场景:

  • 电阻类型:陶瓷功率贴片电阻
  • 封装规格:2512(英制0.25″×0.12″,公制6.4mm×3.2mm)
  • 额定功率:2W(连续负载稳定,峰值功率适配性强)
  • 标称阻值:2kΩ(2000Ω)
  • 阻值精度:±5%(满足工业、消费电子多数场景需求)
  • 额定工作电压:250V(适配低压至中压电路)
  • 温度系数:±100ppm/℃(温变下阻值漂移小)
  • 工作温度范围:-55℃~+155℃(覆盖极端高低温环境)

二、封装与结构特点

1. 2512贴片封装优势

2512是中功率贴片电阻的常用规格,相比插件电阻具备三大核心优势:

  • 体积紧凑:6.4×3.2mm尺寸可节省PCB空间,适配高密度电路设计;
  • 贴装高效:兼容自动化SMT贴装线,降低人工成本与焊接误差;
  • 散热适配:陶瓷基体结合贴片结构,可通过PCB铜箔辅助散热,满足2W功率的热量传导需求。

2. 陶瓷电阻结构特性

以氧化铝陶瓷为基体的电阻,相比碳膜/金属膜电阻:

  • 耐高温性能更强:基体熔点远高于155℃工作上限,无热变形风险;
  • 功率密度高:相同体积下可承载更大功率(2W在2512封装中属常规负载);
  • 稳定性持久:陶瓷材料化学稳定性好,长期使用阻值漂移极小。

三、电气性能与环境适应性

1. 电气性能核心表现

  • 功率/电压/电流约束:额定功率2W,额定电压250V,实际使用需遵循「P≤2W、V≤250V、I≤31.6mA(√(2W/2kΩ))」三者最小值,避免过载;
  • 阻值稳定性:±5%精度可满足工业控制、电源分压等需求;±100ppm/℃温度系数意味着,每变化1℃阻值漂移±0.2Ω,-55℃~+155℃温区内最大变化量仅42Ω(≤±5%精度±100Ω),温变下性能可靠。

2. 环境适应性

  • 宽温覆盖:-55℃~+155℃适配户外设备、高温车间、汽车电子等极端场景;
  • 耐候性:陶瓷基体与贴片封装抗湿度、灰尘侵蚀,符合RoHS 2.0环保标准。

四、典型应用场景

结合参数特点,产品主要应用于以下领域:

  1. 工业控制:PLC模块信号分压、传感器驱动限流,宽温适配车间高低温;
  2. 电源模块:开关电源输出分压、线性电源限流,2W功率满足中等负载;
  3. 消费电子:LED背光驱动限流、音频信号衰减,贴片封装省空间;
  4. 汽车电子辅助电路:车载显示屏背光控制、传感器信号调理,适配-40℃~125℃汽车级温区;
  5. 医疗设备:小型仪器电路分压、限流,稳定温漂确保信号准确。

五、品牌与质量保障

Milliohm品牌专注功率电阻研发,产品质量具备三大支撑:

  • 工艺控制:高精度激光调阻技术确保阻值精度±5%;
  • 可靠性测试:通过155℃×1000h高温老化、-55℃~+155℃×500次温循、85℃/85%RH×1000h湿度测试;
  • 环保合规:无铅焊接兼容,符合RoHS 2.0、REACH指令,适配绿色制造需求。

该产品以高性价比、宽温稳定的特性,成为工业、消费电子等领域中等功率电阻选型的优先方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.