WMSIC Electronic Components

Milliohm HOLRT1206-1W-150MR-1% HOLRT1206

ModelHOLRT1206-1W-150MR-1%
Package1206
BrandMilliohm
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Milliohm HOLRT1206-1W-150MR-1%
Type
MILLIOHM
Minimum package
5000 圆盘

Technical parameters

Power
1W
Electronic Component
Electronic Component
Electronic Component
MILLIOHM
Electronic Component
HOLRT1206-1W-150MR-1%
Electronic Component
1
Package
1206
Electronic Component
Current Sense Resistor / Shunt
Electronic Component
±1%
Electronic Component
0.032g
Electronic Component
150mΩ
Electronic Component
1
Electronic Component
BM0264487177
Electronic Component
SMD
Electronic Component
±100ppm/℃
Resistor Type
Current Sense Resistor
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HOLRT1206-1W-150MR-1% 产品概述

一、产品简介

HOLRT1206-1W-150MR-1% 是一款面向电流采样的贴片型低阻值电阻(采样电阻/毫欧级分流器),封装为标准 1206 尺寸。额定阻值为 150 mΩ,精度 ±1%,额定功率 1 W,温度系数(TCR)±100 ppm/℃。本器件适用于对中低电流进行精确测量和电流保护场景,兼顾精度与PCB安装的可实现性。

二、关键电气参数与典型计算

  • 阻值:0.150 Ω(150 mΩ)
  • 精度:±1%
  • 额定功率:1 W(基于推荐PCB散热条件)
  • TCR:±100 ppm/℃(±0.01%/℃)
  • 封装:1206(贴片)

典型使用计算:

  • 允许连续电流 I = sqrt(P/R) = sqrt(1 / 0.15) ≈ 2.58 A(在额定功率且散热良好时)
  • 在该电流下的压降 V = I·R ≈ 0.387 V
  • 例如 1 A 时压降 = 0.15 V,耗散功率 = 0.15 W

注意:实际可通过PCB铜面积、焊盘设计和环境温度影响器件的允许功率,需结合热设计进行评估。

三、精度与温度漂移影响

±1% 的初始精度保证了在低阻值测量场景下的基础测量可靠性;TCR ±100 ppm/℃ 表示每升高 1℃ 电阻值变化约 0.01%,在较宽温度范围下仍能维持较小的漂移。组合影响需考虑:

  • 初始误差 ±1%
  • 温差造成的额外误差:例如环境与基准温度差 50℃ 时,TCR 引起的变化约 0.5%(50 × 0.01%) 测量系统设计通常采用差分放大、校准或温度补偿以降低温漂对测量精度的影响。

四、封装与安装建议

  • 1206 贴片封装,便于表面贴装(SMT)生产线加工。
  • 为了获得标称功率能力和稳定的温升控制,建议:
    • 增大焊盘铜面积,尤其是两端电流端采用较大铜箔;
    • 如空间允许,在焊盘下方布置热孔并接地铜层以辅助散热;
    • 避免器件靠近高温元件或风道死角;
    • 焊接工艺要控制回流曲线,避免过度加热引起阻值漂移或可靠性问题。

五、典型应用场景

  • 电流采样与电量计算(电池管理系统 BMS、便携电源)
  • 过流检测与限流保护(DC-DC 转换、电机驱动)
  • 功率测量与能耗计量的低压侧分流
  • 各类需要小压降、高精度电流检测的消费电子与工业设备

六、可靠性与选型注意

  • 尽管器件为毫欧级低阻,测量端子及焊点电阻对最终测量影响显著,建议在测量电路中采用合适的差分放大器和接线方式。
  • 对于需要更高精度或更小温漂的场合,可考虑四端(Kelvin)分流器或更低 TCR 的专业电阻型号。
  • 订购时请以厂商提供的完整数据表为准,关注功率-温度降额曲线、焊接规范与环境可靠性测试结果(如温度循环、热冲击等)。

如需进一步的热仿真、PCB 布局示意或与特定测量放大器的匹配建议,可提供应用场景与PCB信息以便给出更具体的实施方案。

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