WMSIC Electronic Components

Nexperia BC849B,215 BC849B

ModelBC849B,215
PackageSOT-23
BrandNexperia
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
Nexperia BC849B, 215
Type
NEXPERIA
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
NEXPERIA
Electronic Component
BC849B,215
Electronic Component
1
Package
SOT-23
Electronic Component
1 NPN
Electronic Component
Transistor(BJT)
Electronic Component
0.025g
Electronic Component
1
Electronic Component
BM0058398933
Operating Temperature
65℃~+150℃
Transistor Type
NPN
Frequency(f T)
100MHz
Power Dissipation(Pd)
250mW
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BC849B,215 产品概述

一、概述与核心参数

BC849B,215 是 Nexperia(安世)推出的一款小功率 NPN 双极型晶体管,采用 SOT-23 封装,适用于通用开关与小信号放大场合。主要电气特性包括:直流电流增益 hFE 高达 240(测试条件 10 μA, VCE=5V),集电极电流 Ic 最大 100 mA,集电极-射极击穿电压 Vceo 为 30 V,集射频率 fT 约 100 MHz,耗散功率 Pd 典型 250 mW,集电极截止电流 Icbo 约 15 nA,射-基击穿电压 Vebo 5 V,饱和电压 VCE(sat) 低至 90 mV(典型条件下)。工作温度范围宽(-65 ℃ 至 +150 ℃),适应性强。

二、性能特点与优势

  • 高电流增益:在低电流工作点下 hFE 值较高,利于微弱信号的放大与偏置简化。
  • 低漏电与低饱和压降:Icbo 小、VCE(sat) 低,适合精密模拟电路与低功耗开关应用。
  • 宽频率响应:约 100 MHz 的 fT 支持高频小信号操作,适用于射频前端与高速开关。
  • SOT-23 小封装:体积小、成本低,适合集成于便携和密集 PCB 设计。

三、典型应用场景

  • 低电流前置放大器、信号检波与放大。
  • 通用开关、驱动小型继电器或指示灯(在额定电流内)。
  • 高阻抗传感器接口、模拟开关及基准电路。
  • 移动设备、便携式测量仪器、消费电子及无线电频段的小信号放大。

四、设计与可靠性建议

  • 热管理:SOT-23 封装的耗散功率受 PCB 铜箔面积与环境温度影响显著,建议在需要更高耗散能力的设计中增大散热铜面积或使用多层板并通过过孔散热。
  • 偏置与保护:为保证长期可靠性,应避免在接近 Vceo 和 Ic 极限处长期工作,必要时加限流或并联保护电路。
  • 高频布局:高频应用时走线应尽量短且使用地平面,输入输出并联旁路电容以抑制寄生振荡。
  • 引脚信息与封装:本型号为 SOT-23 小封装,具体引脚排列与封装尺寸请以 Nexperia 官方数据手册为准。

五、包装与选型提示

型号后缀 “,215” 常见于厂家对卷带或出货形式的标注,订购时请以官方网站或授权分销商的产品资料和料号为准,以确认包装、引脚定义和电气测试条件。

总结:BC849B,215 为一颗性能均衡、适用面广的 NPN 小信号晶体管,兼具高增益、低漏电与良好频率特性,适合各类需在空间受限处实现可靠放大与开关功能的电子设计。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.