WMSIC Electronic Components

Nexperia BAV70,235 BAV70

ModelBAV70,235
PackageSOT-23
BrandNexperia
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
Nexperia BAV70, 235
Type
NEXPERIA
Unit
Electronic Component
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
NEXPERIA
Electronic Component
BAV70,235
Electronic Component
1
Package
SOT-23
Electronic Component
Switch Diode
Electronic Component
0.027g
Electronic Component
1
Electronic Component
BM0058430537
Current
215mA
Diode
1
Current(Ir)
500nA
(Vf)
1.25V@150mA
Power Dissipation(Pd)
250mW
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BAV70,235高速开关双二极管产品概述

BAV70,235是Nexperia(安世半导体)推出的一款高速开关双二极管,采用1对共阴极配置,专为高频切换、紧凑型电路设计,凭借低反向恢复时间、小封装密度及稳定的电气特性,广泛应用于消费电子、通信及工业控制等领域。

一、产品定位与核心属性

作为安世高速二极管系列的经典型号,BAV70,235针对“高速切换+小空间集成”需求优化:采用共阴极双二极管结构(两个二极管共享阴极),支持两路独立或同步切换;基于安世成熟的硅基工艺,平衡了开关速度与功耗,适配从低功耗便携式设备到中等频率通信模块的多元场景。

二、关键参数深度解析

BAV70,235的电气参数精准匹配高速应用需求,核心参数及实际意义如下:

1. 正向压降(Vf)

正向压降1.25V(@150mA),属于常规开关二极管的典型范围,既保证导通时的低损耗(相比部分高压二极管压降更低),又避免因压降过小将信号钳位过度,适合信号调理、逻辑电平切换场景。

2. 反向耐压与漏电流

直流反向耐压(Vr)达100V,可覆盖中等电压场景(如12V/24V系统的反向保护);反向漏电流(Ir)仅500nA(@25℃),低漏电流特性使其在低功耗电路中(如电池供电设备)可减少静态损耗,提升续航。

3. 开关速度核心:反向恢复时间(Trr)

反向恢复时间仅4ns,是该产品的核心优势——普通整流二极管Trr通常在几十ns至几百ns,而BAV70,235的超短Trr可大幅降低高频切换时的开关损耗,避免信号失真,尤其适合10MHz以上的脉冲电路、射频前端切换。

4. 电流与功率规格

  • 整流电流(平均)215mA:满足常规信号级电流需求,如逻辑电路的驱动、传感器信号调理;
  • 最大耗散功率(Pd)250mW:需注意降额使用(实际应用中建议不超过150mW),避免过热;
  • 非重复峰值浪涌电流(Ifsm)4A(8.3ms单脉冲):可承受瞬间过流冲击,如电源启动时的浪涌、静电放电(ESD)间接冲击,提升电路可靠性。

三、封装与物理特性

BAV70,235采用SOT-23封装(3引脚表面贴装),尺寸约为2.9×1.6×1.1mm,属于小型化封装范畴:

  • 引脚定义:通常为“阳极1-公共阴极-阳极2”(需参考 datasheet 确认具体布局),共阴极结构便于两路信号的同步或独立切换;
  • 封装优势:无铅环保(符合RoHS标准),适合回流焊工艺,可高密度集成于PCB,适配智能手机、智能穿戴等紧凑型设备。

四、核心优势总结

  1. 高速切换能力:4ns反向恢复时间,支撑高频脉冲、射频信号的精准切换;
  2. 小空间适配:SOT-23封装节省PCB面积,满足便携式设备的迷你化需求;
  3. 低功耗稳定:低反向漏电流+适中正向压降,兼顾效率与信号完整性;
  4. 浪涌耐受:4A峰值浪涌电流,降低瞬间过流对电路的破坏风险;
  5. 品牌可靠性:安世半导体的工艺保障,参数一致性好,长期稳定性高。

五、典型应用场景

BAV70,235的特性使其适配以下场景:

  • 高速逻辑电路:TTL/CMOS电路的脉冲整形、电平切换(如时钟信号处理);
  • 射频通信模块:无线收发器的信号钳位、ESD保护(配合小封装适配模块空间);
  • 便携式电子:智能手机的电源路径切换、智能手表的传感器信号调理;
  • 工业控制:PLC输入输出接口的信号隔离、编码器的脉冲检测;
  • 汽车电子辅助电路:车载显示屏的背光控制、传感器信号预处理(需确认是否为汽车级,若仅工业级则适用于非车载关键电路)。

综上,BAV70,235凭借高速开关、小封装及稳定电气特性,成为紧凑型高速电路设计的常用选择,尤其适合对空间、速度及功耗有平衡需求的应用场景。

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