WMSIC Electronic Components

KEMET C0402C221K5RACAUTO7411

ModelC0402C221K5RACAUTO7411
BrandKEMET
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 19+

Available for RFQ

Technical data

Product details

11 specifications

Core information

Product name
KEMET C0402C221K5RACAUTO7411
Type
KEMET
Minimum package
50000

Technical parameters

Electronic Component
KEMET
Electronic Component
C0402C221K5RACAUTO7411
Electronic Component
1
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
1g
Electronic Component
50
Electronic Component
BM0000287733
Electronic Component
50000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:C0402C221K5RACAUTO7411

一、产品介绍

C0402C221K5RACAUTO7411 是一款由 KEMET(基美)公司生产的高质量贴片电容器,采用0402封装。这款电容器的电容量为220pF,额定电压为50V,并具有±10%的容差,符合X7R温度特性。厚度仅为0.5mm,使其适合多种空间受限的应用场景。

二、技术参数

  • 型号: C0402C221K5RACAUTO7411
  • 类型: 陶瓷电容(X7R)
  • 封装: 0402
  • 电容量: 220pF
  • 额定电压: 50V
  • 容差: ±10%
  • 厚度: 0.5mm
  • 温度特性: X7R(-55°C 至 +125°C)

三、产品特点

  1. 高可靠性与稳定性: 采用X7R温度特性,具有良好的电容稳定性,适用于多种工作环境。X7R材料在温度变化时,电容值变化幅度较小,确保在高温和低温环境下的可靠工作。

  2. 紧凑封装: 0402尺寸的封装设计,使得电容器的体积非常小巧,适合现代电子设备的轻薄化设计需求,有利于节省电路板空间,提高产品的设计灵活性。

  3. 广泛的应用范围: 可广泛应用于消费电子、通信设备、汽车电子和工业控制等多个领域,特别是在对电路空间有严格要求的设计中,表现尤为突出。

  4. 高频性能良好: 此电容器具有良好的高频特性,适合在高频电路中使用,能够有效降低信号干扰,提高电路整体性能。

四、应用场景

C0402C221K5RACAUTO7411 电容器适用于以下几个主要领域和应用场景:

  • 消费电子产品: 例如智能手机、平板电脑和笔记本电脑等,能够满足紧凑型设计对电容器的需求。

  • 通信设备: 在无线电通信、基站和其他网络设备中,承担滤波、耦合和去耦等功能,确保信号传输的稳定性和可靠性。

  • 汽车电子: 在汽车信息娱乐系统、动力总成控制模块及电池管理系统中,能够提高电路的抗干扰能力,保证系统稳定运行。

  • 工业控制系统: 适用于各种工业电子设备中,提供必要的去耦和滤波功能,有助于提升设备的可靠性和寿命。

五、结论

作为一款高品质的贴片电容器,C0402C221K5RACAUTO7411 凭借其稳定性、可靠性及小尺寸优势,成为众多电子应用中的理想选择。无论是在消费电子、通信设备还是工业控制领域,这款电容器都能发挥重要作用。KEMET品牌在电子元器件领域的卓越声誉和丰富的产品线,使得其产品在市场中备受推崇。选择C0402C221K5RACAUTO7411,不仅是选择了一款高性能的电容器,更是选择了一份对产品质量和应用可靠性的承诺。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.