WMSIC Electronic Components

KEMET(基美) C0603C103K5RACAUTO

ModelC0603C103K5RACAUTO
PackageSMD
BrandKEMET
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
KEMET C0603C103K5RACAUTO
Type
KEMET
Unit
Electronic Component
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
KEMET
Electronic Component
C0603C103K5RACAUTO
Electronic Component
1
Electronic Component
10nF
Package
SMD
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.036g
Electronic Component
1
Electronic Component
BM0257689337
Electronic Component
X7R
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

C0603C103K5RACAUTO 产品概述

一、产品简介

C0603C103K5RACAUTO 为 KEMET(基美)生产的贴片多层陶瓷电容(MLCC),标称容量 10nF(0.01µF),公差 ±10%(K),额定直流电压 50V,介质类型 X7R,封装规格 0603(约 1.6mm × 0.8mm)。该系列适用于表面贴装工艺,兼顾体积小与频率响应良好的特点,适合各种消费电子、工业与汽车电子应用(若为汽车级产品,请参考厂家认证资料)。

二、主要特性

  • 容量:10nF(0.01µF),精度 ±10%。
  • 额定电压:50V DC,适用于中等工作电压场合。
  • 介质:X7R,温度范围典型为 -55°C 至 +125°C,温度引起的容量变动在规定范围内(X7R 型介质在该温区的容量变化通常可接受但非线性)。
  • 封装:0603 SMD,适合高密度贴片板设计。
  • 电气性能:低等效串联电阻(ESR)与较低等效串联电感(ESL),适合高频去耦和滤波场合。

三、典型应用场景

  • 电源去耦与旁路:靠近芯片供电引脚布置以抑制高频噪声。
  • 滤波回路:在模拟与数字电路的输入/输出滤波中常用。
  • 耦合/旁路:用于信号路径的短时隔离与稳定。
  • 一般用途储能/旁路:适合空间受限且对温漂容差要求不高的场合。

四、选型与设计建议

  • DC 偏压效应:X7R 型 MLCC 在施加直流偏压时会出现容量下降,尤其在小封装与高电压条件下更明显。若需保持稳定容量,建议评估工作电压下的实际容量或选择容值和封装更大的器件。
  • 并联使用:为改善频率响应与降低等效电阻,可将不同封装/容值的电容并联使用。
  • 与温度相关的性能:X7R 属温度稳定型但非 C0G,温度变化会引起最多几成的容量偏移,关键电路请按实际温度曲线验证。

五、焊接与可靠性注意事项

  • 回流焊:遵循 KEMET 数据表与 IPC/JEDEC 推荐的回流曲线进行无铅回流焊,避免超出厂家推荐峰值温度与保温时间。
  • 机械应力:0603 尺寸器件对焊盘设计与 PCB 弯曲较为敏感,避免过长焊盘悬伸或在应力集中处贴装,以减少裂纹与开路风险。
  • 贮存与湿度控制:长期存放建议保持原厂干燥包装,贴装前如有必要按建议进行预烘焙以避免回流时湿气导致的裂纹或虚焊。
  • 汽车级或高可靠性要求:若后缀“AUTO”表示汽车供应链相关,请查看厂方的 AEC-Q200 或相关可靠性测试报告以满足车规要求。

六、获取资料与质量保证

欲获取详细电气特性(如温度-容量曲线、DC Bias 曲线、尺寸图与回流建议)和认证信息,请参考 KEMET 官方数据表与质量保证文件。针对批量生产,建议通过供应链或厂方工程支持获取样品进行实装与环境测试验证,确保在目标应用中性能满足设计预期。

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