Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
T521X476M035ATE030是KEMET推出的聚合物固体钽电解电容,针对中高压、高频滤波及紧凑空间设计场景优化,核心优势集中于低等效串联电阻(ESR)、宽温度适应性与高可靠性,可替代传统铝电解电容或普通钽电容,满足工业、汽车及消费电子等领域的严苛需求。
标称容值47μF,精度±20%,覆盖中容量滤波需求——无需额外并联电容即可满足多数电源电路的纹波抑制要求,简化电路设计的同时降低成本。
35V直流额定电压,支持中高压环境下的稳定工作,适配12V/24V系统(如工业控制、车载电源)的升压/降压模块,避免因电压波动导致的电容失效风险。
30mΩ(100kHz下)的低ESR是核心亮点:低ESR可显著降低高频纹波损耗,减少电容自身发热,提升电路效率,尤其适合开关电源、射频电路等高频应用场景。
工作温度范围-55℃至+105℃,覆盖工业级宽温需求——可在高温环境(如车载发动机舱、工业烤箱附近)或低温环境(如极地设备)稳定运行,无需降额使用,适配极端工况。
该电容采用CASE-X-7343-43(mm)封装,对应行业通用的2917封装代码(英寸级尺寸参考),尺寸紧凑(约2.9×1.7mm级别),适配小型化设计趋势——可用于智能手机快充模块、便携式医疗设备、工业控制板的紧凑空间布局,无需牺牲电路性能。
适配PLC、变频器等工业设备的电源模块:35V额定电压满足24V系统需求,105℃高温适应车间高温环境,低ESR抑制开关纹波,保障设备稳定运行。
用于智能手机、平板电脑的快充电路(如USB PD模块):低ESR降低充电发热,宽温适应日常使用的温度变化,提升用户体验。
车载中控、仪表盘电源滤波:宽温范围适配发动机舱附近的高温环境,聚合物钽电容无漏液风险,提升车载可靠性(符合汽车级应用的严苛要求)。
基站、路由器的电源模块滤波:低ESR保证高频信号稳定,长寿命满足通信设备7×24小时运行需求,减少维护频率。
聚合物固体电解质替代传统电解液,避免铝电解电容的漏液、干涸问题,提升设备长期可靠性,降低售后维护成本。
钽电容的固体结构抗振动性能优于铝电解,适合车载、航空航天等振动环境,减少因振动导致的电容失效概率。
105℃下的典型寿命达数千小时(KEMET钽电容技术优势),适配工业、通信等长期运行场景,延长设备整体使用寿命。
KEMET(基美)是全球领先的被动元件制造商,拥有超过70年的钽电容技术积累,产品符合RoHS、REACH等环保标准,部分型号通过AEC-Q200汽车级认证(该型号适配车载场景),供货稳定,质量一致性高,为客户提供可靠的元件解决方案。
该电容凭借其平衡的电气性能、紧凑尺寸与高可靠性,成为中高压高频滤波场景的优选元件,可满足多领域的差异化需求。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products