WMSIC Electronic Components

KEMET T495X477K010ATE100

ModelT495X477K010ATE100
PackageCASE-X-7343-43(mm)
BrandKEMET
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
KEMET T495X477K010ATE100
Type
KEMET
Minimum package
500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
KEMET
Electronic Component
T495X477K010ATE100
Electronic Component
1
Electronic Component
470uF
Package
CASE-X-7343-43(mm)
Electronic Component
Capacitor
Electronic Component
±10%
Electronic Component
0.67g
Electronic Component
1
Electronic Component
BM0000003630
Operating Temperature
55℃~+125℃
Voltage
10V
Electronic Component
Electronic Component
Electronic Component
500
Resistor(ESR)
100mΩ@100kHz

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

KEMET T495X477K010ATE100 产品概述

产品简介

KEMET T495X477K010ATE100 是一款高性能的钽电容器,额定电压为10V,电容值为470µF,主要用于高频电路和需要稳定电源的应用场景。这款电容器的设计考虑到了广泛的工作温度范围(-55°C 至 125°C)和较长的使用寿命,使其适用于各种严苛的工作条件。

主要参数

  • 电压额定值: 10V
  • 电容值: 470µF
  • 等效串联电阻(ESR): 100毫欧(@100kHz)
  • 尺寸: 7.30mm x 4.30mm(0.287" x 0.169")
  • 制造商尺寸代码: X
  • 容差: ±10%
  • 工作温度范围: -55°C ~ 125°C
  • 使用寿命@85°C: 2000小时
  • 安装类型: 表面贴装型(SMD)
  • 高度: 最大0.169"(4.30mm)
  • 特性: 通用型

应用范围

KEMET T495X477K010ATE100 钽电容器广泛应用于消费电子、汽车电子、工业控制、通信设备和医疗设备等领域。由于其卓越的性能,特别是在需要高容量和低ESR的电源滤波、耦合和去耦应用中表现优异,因此被多个行业广泛采纳。

  1. 消费电子: 在智能手机、平板电脑和笔记本电脑等设备中用于电源管理和滤波,提高电源的稳定性和效率。
  2. 汽车电子: 在汽车的电源系统和控制模块中,确保在各种温度和环境条件下都能正常工作,提供可靠的电源供给。
  3. 工业控制: 在工业设备中用于能量存储、快速放电和电源去耦,增强设备的可靠性。
  4. 通信设备: 用于基站和网络设备中,提升信号的质量和电源的稳定性,满足高频应用需求。

设计优势

作为一款钽电容器,T495X477K010ATE100具有以下明显优势:

  • 高容量与体积比: 此款电容器在相对较小的体积内提供了高达470µF的电容量,适合空间受限的设计。
  • 温度适应性强: 在极端温度下工作能力强,使其成为严苛环境应用的理想选择。
  • 长寿命及高可靠性: 采用优质材料和先进的制造技术,确保了在高温和高负载条件下的长使用寿命。

产品规格

  • 温度系数: 该电容器具有良好的温度稳定性,适用于多种温度环境下工作。
  • 封装和安装类型: 其SMD封装设计便于自动化贴装,适用于现代生产线,减少了人工安装的时间和成本。
  • 可焊性: 钽电容的焊接性能良好,适合于表面贴装技术,不容易发生焊接缺陷,保证了生产的高效性。

总结

KEMET T495X477K010ATE100钽电容器是一款高效、可靠、能够适应广泛应用环境的电子元件。其出色的技术参数和设计特点,使其成为针对高频、高容量需求的电路设计中的优选解决方案。对于设计工程师而言,选择KEMET的钽电容器有助于提升整个系统的性能和稳定性,满足现代电子产品对电源管理的严格要求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.