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LPC1768FBD100K
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- NXP LPC1768FBD100K
- Type
- NXP
- Unit
- Electronic Component
- Minimum package
- 450
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- NXP
- Electronic Component
- LPC1768FBD100K
- Electronic Component
- 1
- Package
- LQFP-100(14x14)
- Electronic Component
- MCU(MCU / MPU / SOC)
- Electronic Component
- 2.5g
- CPU
- 32 Bit
- CPU
- ARM Cortex-M3
- I / O
- 70
- RAM
- 64KB
- Electronic Component
- 1
- ADC
- 12bit
- DAC
- 10bit
- Features
- (BOR / LVD / LVR / LVI);; positions(POR); Gate positions; Built-in General Purpose; positions(NRST)
- Electronic Component
- BM0231086732
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LPC1768FBD100K 产品概述
一、核心规格与硬件资源
LPC1768FBD100K 是恩智浦（NXP）基于 ARM Cortex-M3 内核的高性能 32 位单片机，最高主频 100 MHz。片上程序存储器为 512 KB Flash，片上 RAM 为 64 KB，能够满足中大型嵌入式应用的代码和运行时需求。I/O 引脚数量约 70 个，提供丰富的外设接入能力。内置振荡器与 PLL，简化时钟设计与系统上电流程。
二、片上模数/数模与定时资源
芯片集成 12-bit ADC（多通道）与 10-bit DAC，可直接采集模拟量并实现简单的模拟输出控制，适合传感器接口与音频/控制输出场景。片上还有多路定时器与 PWM 通道，支持精确定时、占空比控制与电机驱动等任务，从硬件层面满足实时控制类应用需求。
三、通用外设与接口能力
LPC1768 提供丰富的通信接口，包括多路 UART/USART、I2C、SPI/SSP 以及 CAN（常见工业总线）、USB（Device/Host/OTG 支持）与以太网 MAC（10/100），方便实现与上位机、外设和网络的连接。大量 GPIO 与复用功能使得外设引脚分配灵活，适应多种硬件拓扑。
四、电气特性与封装环境
工作电压范围为 2.4V ~ 3.6V，允许在 3.3V 系统中直接使用；工作温度范围 -40℃ ~ +85℃，符合工业级温度规范。常见封装为 LQFP-100（14×14mm），便于 PCB 布局与散热处理，也利于工程样板与量产。
五、优势与典型应用场景
LPC1768 在计算性能、片上资源与外设扩展之间取得良好平衡，适合工业控制、楼宇自动化、嵌入式网关、数据采集与处理、机器人与运动控制、物联网终端（含以太网/USB 通信）等场景。其成熟的软件生态（Keil、GCC、mbed 等支持）和丰富的外设接口使开发周期短，风险低。
六、选型与工程注意点
在选型时注意 Flash/RAM 满足应用代码与数据需求，并预留 I/O 与外设接口余量；若需高精度模拟测量，应结合外部参考源与滤波设计以发挥 ADC/DAC 性能。LQFP-100 封装需关注走线密度和电源去耦，USB/以太网布局需按规范处理差分阻抗与地平面。总体而言，LPC1768FBD100K 是一款面向工业与高性能嵌入式应用的稳健选择。
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