WMSIC Electronic Components

NX3DV42GU,115 NX3DV42GU

ModelNX3DV42GU,115
PackageX-QFN-10(1.4x1.8)
BrandNXP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
NXP NX3DV42GU, 115
Type
NXP
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
NXP
Electronic Component
NX3DV42GU,115
Electronic Component
1
Package
X-QFN-10(1.4x1.8)
Electronic Component
950MHz
Electronic Component
Analog Switch / Multiplexer
Electronic Component
0.039g
Electronic Component
1
Channel Count
2
Features
Analog; ESD
Electronic Component
BM0231096207
Operating Temperature
40℃~+125℃
Operating Voltage
3V~4.3V
Switch
2:1
(tpd)
250ps

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

NX3DV42GU,115 产品概述

一、概述

NX3DV42GU,115 是恩智浦(NXP)推出的一款面向 USB/高速差分信号切换的单端口 2:1 机电开关 IC。器件在 3.0 V 至 4.3 V 的单电源供电下工作,提供两路信号通道(通常用于 USB2.0 的 D+、D- 差分对)的路径切换,适合移动终端、平板、笔记本和外设接口选择等场景。器件采用小尺寸 X-QFN-10(1.4 mm x 1.8 mm)封装,适合空间受限的便携式产品。

二、主要参数与优势

  • 工作电压:3.0 V ~ 4.3 V,直接兼容 3.3 V 系统供电。
  • 通道数与拓扑:2:1 切换,两个并行信号通道,适配一组差分信号的切换需求。
  • 导通电阻 (Ron):典型 3.9 Ω(低导通电阻有利于减小插入损耗)。
  • 导通电容 (Con):7.3 pF,较小的开关电容有利于维持高速信号完整性。
  • 带宽:950 MHz,可支持 USB2.0 高速 (480 Mbps) 及其它 MHz 级高速信号。
  • 传播延迟 (tpd):250 ps,低延迟有助于差分对时序一致性。
  • 工作温度范围:-40 ℃ ~ +125 ℃,适合商业及工业级应用环境。
    这些参数共同保证了器件在高速差分信号路径中具有低损耗、低畸变和良好时序性能。

三、封装与引脚(概述)

NX3DV42GU,115 采用 X-QFN-10 封装(1.4 × 1.8 mm),占板面积小、厚度低,适用于紧凑型 PCB 布局。典型引脚包括供电(VCC)、地(GND)、两路差分信号的输入/输出脚以及控制引脚(用于选择路径)。在实际设计中,需要为 VCC 旁加 0.1 µF 陶瓷去耦电容,靠近器件引脚放置以抑制电源噪声。

四、典型应用与设计建议

  • 典型应用:USB OTG/端口选择、外设/扩展坞信号路由、多接口设备中 USB 路径切换、测试夹具或生产线上信号切换。
  • 布局建议:差分对应保持成对走线、阻抗匹配,缩短关键走线长度,控制差分对长度差以降低抖动与串扰。
  • 电源与去耦:VCC 使用稳压 3.3 V,推荐在 VCC 与 GND 之间放置 0.1 µF 陶瓷去耦,若有长供电线可增加更大容量电容。
  • ESD 与保护:虽器件适用于接口切换,仍建议在系统设计中根据具体环境添加必要的 ESD 抗扰措施与共模抑制元件。

五、选型与注意事项

  • 在选择时确认系统供电电压范围在 3.0–4.3 V 内,并评估器件的导通电阻与通路电容对信号眼图的影响。
  • 对于关心抖动/时延预算的系统,参考 250 ps 的 tpd 与 3.9 Ω 的 Ron,评估差分对的时序裕量。
  • 封装后缀 “,115” 为厂商的包装/订购代码,购买时以完整料号下单以保证包装与出货方式一致。

NX3DV42GU,115 以其低插入损耗、窄体封装及对高速差分信号的良好适配性,适合需要在受限空间内实现可靠 USB 路径切换的便携与嵌入式系统。若需更详细的电气特性曲线或参考电路,请查阅恩智浦官方数据手册。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.