WMSIC Electronic Components

MKL17Z64VFM4

ModelMKL17Z64VFM4
PackageQFN-32-EP(5x5)
BrandNXP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
NXP MKL17Z64VFM4
Type
NXP
Minimum package
490 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
NXP
Electronic Component
MKL17Z64VFM4
Electronic Component
1
Package
QFN-32-EP(5x5)
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
0.06g
CPU
32 Bit
CPU
ARM Cortex-M0+
I / O
28
RAM
16KB
Electronic Component
1
ADC
16bit
Electronic Component
BM0257380915
Operating Temperature
40℃~+105℃
Operating Voltage
1.71V~3.6V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

NXP MKL17Z64VFM4 单片机产品概述

一、核心性能与架构

MKL17Z64VFM4是恩智浦Kinetis L系列中针对低功耗+高性能平衡设计的32位单片机,核心采用ARM Cortex-M0+ 处理器内核:

  • 最大工作主频达48MHz,支持单周期乘法运算,指令执行效率优于8/16位单片机,可满足多数中低端嵌入式应用的实时性需求;
  • 内置高精度内部振荡器,无需外部晶振即可稳定运行,进一步简化电路设计、降低BOM成本;
  • 原生支持Cortex-M0+低功耗模式(睡眠、深度睡眠),配合芯片内部电源管理单元(PMU),可将待机功耗降至微安级,延长电池供电设备续航。

二、存储与接口资源

(一)存储容量

  • 程序存储器:64KB FLASH,支持1KB页擦除(最小擦除单元),常温下数据保持能力超10年,可反复编程(擦写次数≥10万次);
  • 数据存储器:16KB SRAM,用于变量存储、堆栈及外设数据缓存,满足常规应用的内存需求。

(二)外设与接口

  • 数字I/O:共28个通用I/O引脚,支持上拉/下拉电阻配置、中断触发(上升沿/下降沿/双边沿),灵活适配数字信号输入输出;
  • 模拟接口:集成16位分辨率ADC,支持多通道采样(实际支持10+通道,适配QFN-32封装),采样速率可达1Msps,适合高精度模拟信号采集(如传感器数据、电压电流监测);
  • 通信接口:内置1路UART(支持LIN协议)、1路SPI(主/从模式)、1路I2C(最高100kHz),可实现设备间数据交互(如与传感器、显示模块通信)。

三、电源与工作环境

(一)电源特性

工作电压范围为1.71V~3.6V,覆盖锂电池(3.7V典型)、干电池(3V)等常见供电方式;内置电源监测模块,可检测欠压状态并触发复位,提升系统可靠性。

(二)工作温度范围

支持**-40℃~+105℃** 工业级温度范围,可适应户外、车载等恶劣环境下的长期稳定工作,无需额外温度补偿电路。

四、封装与典型应用场景

(一)封装形式

采用QFN-32-EP(5×5mm) 封装,带暴露焊盘(EP)增强散热性能,小尺寸设计适合小型化产品,可有效节省PCB空间。

(二)典型应用

  • 工业控制:小型电机驱动、温度/压力传感器节点、工业物联网(IIoT)终端;
  • 消费电子:智能手环/手表、智能家居控制器(灯光/窗帘)、小型家电;
  • 汽车电子:车载传感器(胎压监测辅助节点)、低功耗车载终端;
  • 医疗电子:便携式医疗设备(血糖监测仪、小型监护仪)。

五、产品核心优势

  1. 低功耗与高性能平衡:Cortex-M0+内核结合宽电压范围,兼顾运算效率与待机功耗,适合电池供电设备;
  2. 宽温与可靠性:-40℃~+105℃工业级温度范围,内置电源监测,提升恶劣环境稳定性;
  3. 高集成度与小封装:64KB FLASH+16KB RAM+16位ADC+通信接口集成于5×5mm封装,简化设计;
  4. 设计灵活性:28个I/O支持多种配置,内置振荡器无需外部晶振,降低BOM成本。

该芯片凭借稳定的性能、宽范围的工作条件及小尺寸设计,成为中低端嵌入式系统的高性价比选择。

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