WMSIC Electronic Components

PCF85162T/1Y PCF85162T

ModelPCF85162T/1Y
PackageTFSOP-48-6.1mm
BrandNXP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Electronic Component

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
NXP PCF85162T / 1Y
Type
NXP
Minimum package
2000 圆盘

Technical parameters

Electronic Component
1/3,1/2
Electronic Component
Electronic Component
Electronic Component
NXP
Electronic Component
PCF85162T/1Y
Electronic Component
1
Package
TFSOP-48-6.1mm
Electronic Component
LCDDriver
Electronic Component
0.3g
Electronic Component
1
Features
Integrated; Built-in Oscillator
Electronic Component
BM0266030423
Operating Temperature
40℃~+85℃
Operating Voltage
1.8V~5.5V
Operating Current
3.5uA
Interface Type
I²C
Display
32x4 bit

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PCF85162T/1Y 产品概述

一、产品简介

PCF85162T/1Y 是恩智浦(NXP)推出的一款低功耗 I²C 总线 LCD 驱动器,适用于字符或段式小型显示模块。器件工作电压范围为 1.8V 至 5.5V,工作温度范围为 -40℃ 至 +85℃,提供两档偏压(1/3 与 1/2),常见显示配置为 32×4 位,封装为 TFSOP-48-6.1mm。器件静态与待机电流极低,典型工作电流约 3.5 μA,适合电池供电及低功耗应用。

二、主要特性

  • 工作电压:1.8 V ~ 5.5 V,兼容多种系统电源。
  • 接口类型:I²C,总线化控制,节省 MCU 引脚。需外接上拉电阻。
  • 工作电流:约 3.5 μA(典型,实际耗流随显示负载与工作模式有所变化)。
  • 偏压选项:1/3 与 1/2,可根据显示模块与对比度需求选择合适驱动电压比。
  • 显示配置:支持 32×4 位常见配置,适配小字符显示或多段式显示。
  • 温度范围:-40℃ ~ +85℃,满足工业级可靠性要求。
  • 封装:TFSOP-48-6.1mm,便于表面贴装与高密度 PCB 布局。

三、功能与应用场景

PCF85162T/1Y 专为字符/段式 LCD 驱动设计,常用于消费类设备、人机界面、仪器仪表、家电控制面板、便携式测量仪器及物联网终端等。I²C 总线方便多个外设共用同一对信号线,适合 MCU 引脚资源有限或需集中管理显示的系统。

四、电气与设计注意事项

  • 电源管理:建议在 VCC 近端放置 0.1 μF 陶瓷去耦电容,并在必要时并联 1 μF 以上电容以稳定电源;上电时遵循器件与 LCD 模块的时序要求,避免电压突变引起错误显示。
  • I²C 接口:外部需配置适当上拉电阻(典型 4.7kΩ),并根据总线长度与速率调整阻值。器件兼容常见 I²C 工作速率(如 100 kHz/400 kHz),具体速率以系统总线与多个器件共同工作情况确定。
  • 偏压与对比度:通过选择 1/3 或 1/2 偏压,可以改变 LCD 的驱动电压幅度,从而优化对比度与功耗。较高偏压通常提升显示对比度但增加应力与能耗,选择时参考具体显示模块规格。
  • PCB 布局:将电源去耦尽量靠近器件 VCC 与 GND 引脚布局;信号走线尽量短且避开噪声源;若驱动大量段、共阳/共阴接线,应评估走线电阻和回流路径对显示稳定性的影响。
  • 热与可靠性:器件支持工业温度,但在高环境温度或长期高负载条件下应考虑散热与寿命影响;做好 ESD 保护与 EMI 抑制设计有助于提高系统可靠性。

五、固件与调试要点

  • 初始化与命令流:通过 I²C 向器件写入初始化命令以设置偏压、显示模式与段映射;遵循芯片及 LCD 模块的时序规范,避免在未完成初始化前发送显示数据。
  • 对比度调节:在调试阶段通过切换偏压和调整软件配置寻找最佳对比度与视角;在最终产品中可考虑提供软件或外部电位器微调。
  • 故障排查:若出现无显示或闪烁,优先检查电源稳定性、I²C 地址/总线冲突、上拉电阻与偏压选择;借助示波器观察 SCL/SDA 波形,确认时序与 ACK 信息。

六、封装与采购提醒

PCF85162T/1Y 提供 TFSOP-48-6.1mm 封装,适用于自动化贴片生产。采购时注意确认器件版本与批次,索取最新资料与应用手册以获取完整管脚定义、寄存器说明及典型应用电路。对于量产应用,建议与供应商确认长期可用性与质量保证条款。

总结:PCF85162T/1Y 以其宽电压范围、低功耗 I²C 控制与偏压灵活性,成为对成本、功耗与 PCB 空间有要求系统的优选 LCD 驱动器。良好的电源去耦、合适的偏压选择与 I²C 总线设计是实现稳定显示的关键。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.