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NX3DV3899GU,115 NX3DV3899GU
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- NXP NX3DV3899GU, 115
- Type
- NXP
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- NXP
- Electronic Component
- NX3DV3899GU,115
- Electronic Component
- 1
- Package
- UQFN-16(1.8x2.6)
- Electronic Component
- 200MHz
- Electronic Component
- Analog Switch / Multiplexer
- Electronic Component
- 0.108g
- Electronic Component
- 1
- Channel Count
- 4
- Features
- Analog; Level Conversion; ESD
- Electronic Component
- BM0249828069
- Operating Temperature
- 40℃~+125℃
- Operating Voltage
- 1.4V~4.3V
- Switch
- 2:1
- Capacitor(Con)
- 30pF
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
NX3DV3899GU,115 产品概述
一、产品简介
NX3DV3899GU,115 是恩智浦（NXP）推出的一款高速、低电阻的模拟开关芯片，采用 UQFN-16 (1.8 x 2.6 mm) 封装。器件集成两组 2:1 开关电路（总计 4 路通道），适合在低电压供电系统中进行信号路由与多路选择，兼顾体积、功耗与信号完整性。
二、主要特性
- 工作电压范围：1.4 V ~ 4.3 V，支持常见单电源电平（如 1.8 V、3.3 V）
- 典型导通电阻（RON）：2.2 Ω（在典型工作电压下）
- 导通电容（CON）：约 30 pF，利于保持良好带宽与信号保真
- 带宽：约 200 MHz，适用于低至中等频率的模拟/数模切换
- 工作温度范围：-40 ℃ ~ +125 ℃，适用于工业级环境
- 小型 UQFN-16 封装，便于高密度布局与自动贴装
三、典型应用
- 多路音频、视频信号切换与路由
- 传感器信号切换与通道选择（低压采样前端）
- 耐压与隔离要求不高的射频前端选择（低中频）
- 移动与便携设备中的信号复用、测试切换电路
四、封装与引脚概要
封装形式为 UQFN-16 (1.8 x 2.6 mm)，占板面积小，热性能与引出可靠性良好。器件引脚包括电源、地、各通道开关控制输入与四路信号引脚。布局时建议在电源引脚附近加旁路电容，减小开关瞬态影响。
五、设计与使用建议
- 电源去耦：在 VCC 近旁放置 0.1 μF 陶瓷旁路电容以抑制高频噪声。
- 信号幅度：输入/输出信号应限制在器件工作电源轨内，避免超出 VCC/GND 导致性能退化或损伤。
- PCB 布局：对于较高频率信号，尽量缩短走线并保持阻抗连续，降低寄生电容与串扰。
- 热管理：尽管功耗较低，但在高温或密集布局环境下注意散热路径，保证器件在额定温度范围内工作。
如需详细电气特性曲线、引脚图或参考电路图，建议查阅 NXP 原厂数据手册以获得完整规范与典型应用电路。
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