Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
NTA53321G0FHKZ是恩智浦(NXP)推出的NTAG5系列高频RFID/NFC芯片,针对紧凑设计场景优化,集成I2C有线接口与无线射频通信能力,广泛适配消费电子、物流追踪、工业物联网等领域的低功耗、小型化应用需求。
该芯片属于NXP NTAG5产品线的16-XFQFN封装型号,核心支持两大行业通用协议:
协议兼容性确保芯片可无缝对接现有RFID系统与NFC生态,无需额外适配成本。
芯片核心参数覆盖通信、接口、电源、封装四大维度,直接支撑应用场景适配:
参数类别 具体规格 应用价值 工作频率 13.56MHz(全球通用高频段) 抗干扰性强,符合RFID/NFC标准 通信协议 ISO 15693、NFC 覆盖RFID追踪与NFC交互双场景 接口类型 I2C(两线制) 与MCU/传感器快速集成,布线极简 工作电压 1.62V~5.5V宽范围 适配1.8V低功耗MCU到5V电源系统 封装形式 16-XFQFN(极小型无引脚) 尺寸紧凑(约3×3mm),适合小型设备芯片采用I2C有线接口+13.56MHz无线射频的双通信架构,平衡集成灵活性与交互便捷性:
双通信架构特别适合“本地数据处理+无线上传”的场景(如智能传感器节点)。
电源设计是芯片的核心优势之一:
16-XFQFN封装是芯片的关键设计亮点:
结合芯片参数与特性,其核心应用场景包括:
综上,NTA53321G0FHKZ凭借宽电压、双通信、小型化封装等优势,成为紧凑设计场景下RFID/NFC应用的高性价比选择,适配多行业的低功耗、无线交互需求。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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