WMSIC Electronic Components

S32K312NHT0MPASR

ModelS32K312NHT0MPASR
PackageQFP-100(10x10)
BrandNXP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
NXP S32K312NHT0MPASR
Type
NXP
Minimum package
600 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
NXP
Electronic Component
S32K312NHT0MPASR
Electronic Component
1
Package
QFP-100(10x10)
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
1g
CPU
32 Bit
CPU
ARM Cortex-M7
I / O
84
RAM
192KB
Electronic Component
1
EEPROM
128KB
Features
(BOR / LVD / LVR / LVI);; positions(POR); Gate positions; Built-in General Purpose; CRC; ECC
Electronic Component
BM0257695808
Operating Temperature
40℃~+125℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

S32K312NHT0MPASR 产品概述

一、产品简介

S32K312NHT0MPASR 是恩智浦(NXP)面向通用与车规级应用设计的 32 位 ARM Cortex-M7 微控制器,主频最高可达 120 MHz。器件集成 2 MB Flash 程序存储、192 KB RAM 以及 128 KB EEPROM,提供丰富的片上资源和片外接口能力(包含 CAN FD),并内置 HSE B 等级的安全特性,适合对性能、可靠性和安全性有较高要求的嵌入式系统。

二、核心规格

  • 处理器内核:ARM Cortex-M7,32-bit,最高 120 MHz
  • 程序存储:2 MB Flash(片上)
  • 内存:192 KB RAM
  • 非易失存储:128 KB EEPROM
  • I/O 数量:84 个可用 I/O 引脚
  • 通信:支持 CAN FD(车载高速域网)
  • 安全:HSE B 等级安全特性
  • 振荡器:支持内部与外部晶振(内置 + 外置)
  • 工作电源:2.97 V ~ 5.5 V
  • 工作温度:-40 ℃ ~ +125 ℃(车规/工业级)
  • 封装/引脚:172 引脚 HDQFP(S32K 系列常见封装)
  • 标准调试支持:常见 ARM 调试接口(如 SWD/JTAG)和片上引导功能

三、关键特性与优势

  • 高效能计算:Cortex‑M7 内核在同类 MCU 中具备较好指令吞吐能力,适合对控制周期与响应时间敏感的任务。
  • 大容量存储:2 MB Flash 与 192 KB RAM 可容纳更复杂的固件、通信栈和诊断代码;128 KB EEPROM 便于存放校准数据、参数和持久化配置。
  • 车规通信能力:原生支持 CAN FD,满足现代车载网关、域控制器对高速可靠通信的需求。
  • 安全性:集成 HSE B 等级安全模块,便于实现安全启动、密钥管理与固件完整性保护。
  • 宽温与宽电压工作:适合车载与严苛工业环境,抗干扰与耐高低温能力强。
  • 丰富引脚与外设扩展性:84 个 I/O 与 172 引脚封装,能支持多路传感器、外设与扩展接口布局。

四、典型应用场景

  • 汽车车身电子、域控制器与网关(支持 CAN FD 通信)
  • 电机控制与智能驱动(需要高实时性能的控制算法)
  • 工业自动化控制器与现场总线节点
  • 智能传感器网关、数据采集与边缘处理单元
  • 需要安全启动与数据保护的嵌入式系统

五、设计与工程注意事项

  • 电源与去耦:推荐在器件电源引脚附近做充分的去耦电容与滤波,保证 2.97 V~5.5 V 范围内稳定供电。
  • 时钟设计:根据性能与功耗需求选择内部或外部晶振,并做好时钟分频和相位噪声控制。
  • EMC 与布板:车载与工业场景对 EMC 要求高,建议按高速 CAN 与时钟布局规则,做差分对、隔离及地分割。
  • 引导与固件升级:利用片上安全特性实现安全引导与固件 OTA/在线升级,结合 EEPROM 存储关键参数。
  • 调试与开发:推荐使用 NXP S32 Design Studio 与 S32 SDK 进行软件开发与调试,利用标准调试接口进行断点与在线测试。

六、采购与技术支持

S32K312NHT0MPASR 属于 S32K 系列通用车规 MCU,适配 NXP 的开发工具链和软件生态。采购时请确认具体封装、温度等级与货期,并与供应商确认最新的数据手册与应用笔记,以便在硬件布局与软件移植阶段获得全面支持。若需高可靠性或安全认证相关信息,可与 NXP 授权渠道沟通获取详尽资料。

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